DescriptionThe XC4LVX25-10SF363C is a member of Virtex-5 FPGA family with 24,192 logic cells, 10,752 slices, 168 Kb distributed RAM (Max), 48 Xtreme DSP slices, 72 18 Kb blocks and 1,296 Kb block RAM (Max). It contains many hard-IP system level blocks, including powerful 36-Kbit block RAM/FIFOs, s...
XC4LVX25-10SF363C: DescriptionThe XC4LVX25-10SF363C is a member of Virtex-5 FPGA family with 24,192 logic cells, 10,752 slices, 168 Kb distributed RAM (Max), 48 Xtreme DSP slices, 72 18 Kb blocks and 1,296 Kb block RA...
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The XC4LVX25-10SF363C is a member of Virtex-5 FPGA family with 24,192 logic cells, 10,752 slices, 168 Kb distributed RAM (Max), 48 Xtreme DSP slices, 72 18 Kb blocks and 1,296 Kb block RAM (Max). It contains many hard-IP system level blocks, including powerful 36-Kbit block RAM/FIFOs, second generation 25 x 18 DSP slices, SelectIO™ technology with built-in digitallycontrolled impedance, ChipSync™ source-synchronous interface blocks, system monitor functionality, enhanced clock management tiles with integrated DCM (Digital Clock Managers) and phase-locked-loop (PLL) clock generators, and advanced configuration options. Built on a 65-nm state-of-the-art copper process technology, it is a programmable alternative to custom ASIC technology.
There are some features of XC4LVX25-10SF363C as follows. (1) five platforms LX, LXT, SXT, TXT, and FXT; (2) cross-platform compatibility: LXT, SXT, and FXT devices are footprint compatible in the same package using adjustable voltage regulators; (3) powerful clock management tile (CMT) clocking; (5) 36-Kbit block RAM/FIFOs; (6) high-performance parallel SelectIO technology; (7) advanced DSP48E slices; (8) flexible configuration options; (9) system monitoring capability on all devices; (10) integrated Endpoint blocks for PCI express designs; (11) tri-mode 10/100/1000 Mb/s Ethernet MACs; (12) RocketIO GTP transceivers 100 Mb/s to 3.75 Gb/s: LXT and SXT platforms; (13) RocketIO GTX transceivers 150 Mb/s to 6.5 Gb/s: TXT and FXT platforms; (14) 65-nm copper CMOS process technology; (15) 1.0 V core voltage; (16) high signal-integrity flip-chip packaging available in standard or Pb-free package options.
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