XA2C256

• AEC-Q100 device qualification and full PPAP support available in both I-grade and extended temperature Q-grade
• Guaranteed to meet full electrical specifications over T_A = -40 to +105 with T_J Maximum = +125 (Q-grade)
• Optimized for 1.8V systems
• Industry's best 0.18 micron CMOS CPLD
- Optimized architecture for effective logic synthesis. Refer to the CoolRunner™-II family data sheet forarchitecture description.
- Multi-voltage I/O operation - 1.5V to 3.3V
• Available in multiple package options
- 100-pin VQFP with 80 user I/O
- 144-pin TQFP with 118 user I/O
- Pb-free only for all packages
• Advanced system features
- Fastest in system programming
` 1.8V ISP using IEEE 1532 (JTAG) interface
- IEEE1149.1 JTAG Boundary Scan Test
- Optional Schmitt-trigger input (per pin)
- Unsurpassed low power management
` DataGATE enable (DGE) signal control
- Two separate I/O banks
- RealDigital 100% CMOS product term generation
- Flexible clocking modes
` Optional DualEDGE triggered registers
` Clock divider (divide by 2,4,6,8,10,12,14,16)
` CoolCLOCK
- Global signal options with macrocell control
` Multiple global clocks with phase selection per macrocell
` Multiple global output enables
` Global set/reset
- Advanced design security
- PLA architecture
` Superior pinout retention
` 100% product term routability across function block
- Open-drain output option for Wired-OR and LED drive
- Optional bus-hold, 3-state or weak pull-up on selected I/O pins
- Optional configurable grounds on unused I/Os
- Mixed I/O voltages compatible with 1.5V, 1.8V, 2.5V, and 3.3V logic levels
- Hot pluggable WARNING: Programming temperature range of TA = 0 to +70.

Notes:
1. Maximum DC undershoot below GND must be limited to either 0.5V or 10 mA, whichever is easiest to achieve. During transitions, the device pins may undershoot to 2.0v or overshoot to +4.5V, provided this over or undershoot lasts less than 10 ns and with the forcing current being limited to 200 mA.
2. Valid over commercial temperature range.
3. For soldering guidelines and thermal considerations, see the Device Packaging information on the Xilinx website. For Pb free packages, see XAPP427.

The XA2C256 CoolRunner™-II Automotive 256-macrocell device is designed for both high performance and low power applications. This lends power savings to high-end communication equipment and high speed to battery operated devices. Due to the low power stand-by and dynamic operation, overall system reliability is improved

This XA2C256 consists of sixteen Function Blocks inter-connected by a low power Advanced Interconnect Matrix (AIM). The AIM feeds 40 true and complement inputs to each Function Block. The Function Blocks consist of a 40 by 56 P-term PLA and 16 macrocells which contain numerous configuration bits that allow for combinational or registered modes of operation.

Additionally, these XA2C256 registers can be globally reset or preset and configured as a D or T flip-flop or as a D latch. There are also multiple clock signals, both global and local product term types, configured on a per macrocell basis. Output pin configurations include slew rate limit, bus hold, pull-up, open drain and programmable grounds. A Schmitt-trigger input is available on a per input pin basis. In addition to storing macrocell output states, the macrocell registers may be configured as "direct input" registers to store signals directly from input pins.

Clocking is available on a global or Function Block basis. Three global clocks are available for all Function Blocks as a synchronous clock source. Macrocell registers can be individually configured to power up to the zero or one state. A global set/reset control line is also available to asynchronously set or reset selected registers during operation. Additional local clock, synchronous clock-enable, asynchronous set/reset and output enable signals can be formed using product terms on a per-macrocell or per-Function Block basis. A DualEDGE flip-flop feature is also available on a per macrocell basis. This feature allows high performance synchronous operation based on lower frequency clocking to help reduce the total power consumption of the device. XA2C256 Circuitry has also been included to divide one externally supplied global clock (GCK2) by eight different selections. This yields divide by even and odd clock frequencies.