X1007-BD

Features: Integrated Gain, Doubler and Driver StagesSelf-biased Architecture+21.0 dBm Output Saturated Power40.0 dBc Fundamental SuppressionOn-Chip ESD Protection100% On-Wafer RF, DC and Output Power Testing100% Visual Inspection to MIL-STD-883 Method 2010Specifications Supply Voltage (Vd)S...

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X1007-BD Picture
SeekIC No. : 004547033 Detail

X1007-BD: Features: Integrated Gain, Doubler and Driver StagesSelf-biased Architecture+21.0 dBm Output Saturated Power40.0 dBc Fundamental SuppressionOn-Chip ESD Protection100% On-Wafer RF, DC and Output Powe...

floor Price/Ceiling Price

Part Number:
X1007-BD
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/20

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Product Details

Description



Features:

Integrated Gain, Doubler and Driver Stages
Self-biased Architecture
+21.0 dBm Output Saturated Power
40.0 dBc Fundamental Suppression
On-Chip ESD Protection
100% On-Wafer RF, DC and Output Power Testing
100% Visual Inspection to MIL-STD-883 Method 2010



Specifications

Supply Voltage (Vd)
Supply Current (Id)
Gate Bias Voltage (Vg)
Input Power (RF Pin)
Storage Temperature (Tstg)
Operating Temperature (Ta)
Channel Temperature (Tch)
+6.0 VDC
300 mA
+0.3 VDC
TBD
-65 to +165
-55 to MTTF Table 1
MTTF Table 1
(1) Channel temperature affects a device's MTTF. It is recommended to keep channel temperature as low as possible for maximum life.


Description

Mimix Broadband's 13.5-17.0 / 27.0-34.0 GHz GaAs MMIC doubler integrates a gain stage, passive doubler and driver amplifier onto a single device. The X1007-BD has a self-biased architecture requiring a single positive supply (+5V) only and integrated on-chip bypassing capacitor eliminating the need for external capacitor. This MMIC uses Mimix Broadband's 0.15um GaAs PHEMT device model technology, and is based upon electron beam lithography to ensure high repeatability and uniformity. The X1007-BD has integrated ESD structures for protection and surface passivation to protect and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. The X1007-BD is well suited for Millimeter wave Point-to-Point Radio, LMDS, SATCOM and VSAT applications.




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