Features: · Access times of 25ns (SRAM) and 120ns (FLASH)· Packaging• 66 pin, PGA Type, 1.385 square HIP, hermetic ceramic HIP (Package 402)• 68 lead, hermetic CQFP (G2T), 22.4mm (0.880 ) square (Package 509) 4.57mm (0.180 ) height Designed to fi t JEDEC 68 lead 0.990 CQFJ footprint ...
WSF41632-22XX: Features: · Access times of 25ns (SRAM) and 120ns (FLASH)· Packaging• 66 pin, PGA Type, 1.385 square HIP, hermetic ceramic HIP (Package 402)• 68 lead, hermetic CQFP (G2T), 22.4mm (0.880...
SeekIC Buyer Protection PLUS - newly updated for 2013!
268 Transactions
All payment methods are secure and covered by SeekIC Buyer Protection PLUS.
· Access times of 25ns (SRAM) and 120ns (FLASH)
· Packaging
• 66 pin, PGA Type, 1.385" square HIP, hermetic ceramic HIP (Package 402)
• 68 lead, hermetic CQFP (G2T), 22.4mm (0.880") square (Package 509) 4.57mm (0.180") height Designed to fi t JEDEC 68 lead 0.990" CQFJ footprint (FIGURE 2). Package to be developed.
· 128Kx32 SRAM
· 512Kx32 5V Flash
· Organized as 128Kx32 of SRAM and 512Kx32 of Flash Memory with common data bus
· Low power CMOS
· Commercial, industrial and military temperature ranges
· TTL compatible inputs and outputs
· Built-in decoupling caps and multiple ground pins for low noise operation
· Weight - 13 grams typical
Parameter | Symbol | Min | Max | Unit |
Operating Temperature | TA | -55 | +125 | |
Storage Temperature | TSTG | -65 | +150 | |
Signal Voltage Relative to GND | VG | -0.5 | 7.0 | V |
Junction Temperature | TJ | 150 | ||
Supply Voltage | VCC | -0.5 | 7.0 | V |