Features: Fast Access Time- tACC= 35 ns- tCE= 35 nsLow Power Consumption- 200 A Standby ICCImmune to Latch-UP- Up to 200 mAESD Protection Exceeds 2000 VoltsAvailable in 300 Mil DIP and PLDCCDESC SMD No. 5962-86063PinoutSpecificationsStorage Temperature....................................65° to + 1...
WS57C256F: Features: Fast Access Time- tACC= 35 ns- tCE= 35 nsLow Power Consumption- 200 A Standby ICCImmune to Latch-UP- Up to 200 mAESD Protection Exceeds 2000 VoltsAvailable in 300 Mil DIP and PLDCCDESC SMD...
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PinoutSpecificationsStorage Temperature....................65° to + 150°CVoltage on any Pin withRe...
PinoutDescriptionThe WS57C191C-55 is one member of the WS57C191 family which is designed as the ex...
The WS57C256F is a High Performance 32K x 8 UV Erasable EPROM. It is manufactured using an advanced CMOS process technology enabling it to operate at speeds as fast as 35 ns Address Access Time (tACC ) and 35 ns Chip Enable Time (tCE ). It was designed utilizing WSI's patented self aligned split gate EPROM cell, resulting in a low power device with a very cost effective die size. The low standby power capability of this 256 K product (200 in a CMOS interface environment) is especially attractive.
This product, with its high speed capability, is particularly appropriate for use with today's fast DSP processors and high-clock-rate Microprocessors. The WS57C256F's 35 ns speed enables these advanced processors to operate without introducing any undesirable wait states. The WS57C25 6F is also ideal for use in modem applications, and is recommended for use in these applications by the leading modem chip set manufacturer.
The WS57C256F is available in a variety of package types including the space saving 300 Mil DIP, the surface mount PLDCC, and other windowed and non-windowed options. And its standard JEDEC EPROM pinouts provide for automatic upgrade density paths for current 64K and 128K EPROM users.