Features: • 6 Filters per device• Ultra small footprint, 0.5mm pitch• Silicon substrate• 0.30mm Eutectic Solder BumpsApplication• EMI filter for Mobile Equipment (e.g. Cellular Phones)• Evaluation Device
WLP200: Features: • 6 Filters per device• Ultra small footprint, 0.5mm pitch• Silicon substrate• 0.30mm Eutectic Solder BumpsApplication• EMI filter for Mobile Equipment (e.g. ...
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