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WF1M32B-XXX3

Features: Access Times of 100, 120, 150ns Packaging• 66 pin, PGA Type, 1.185 square, Hermetic Ceramic HIP (Package 401)• 68 lead, Low Profi le CQFP (G2T), 4.6mm (0.180 ) square (Package 509) 1,000,000 Erase/Program Cycles Sector Architecture• One 16KByte, two 8KBytes, one 32KBy...

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SeekIC No. : 004545628 Detail

WF1M32B-XXX3: Features: Access Times of 100, 120, 150ns Packaging• 66 pin, PGA Type, 1.185 square, Hermetic Ceramic HIP (Package 401)• 68 lead, Low Profi le CQFP (G2T), 4.6mm (0.180 ) square (Packag...

WF1M32B-XXX3 Data Sheet

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Part Number:
WF1M32B-XXX3
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/21

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Product Details

Description



Features:

Access Times of 100, 120, 150ns
Packaging
• 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP (Package 401)
• 68 lead, Low Profi le CQFP (G2T), 4.6mm (0.180") square (Package 509)
1,000,000 Erase/Program Cycles
Sector Architecture
• One 16KByte, two 8KBytes, one 32KByte, and fi fteen 64kBytes in byte mode
• Any combination of sectors can be concurrently erased. Also supports full chip erase
Organized as 1Mx32
Commercial, Industrial and Military Temperature Ranges
3.3 Volt for Read and Write Operations
Boot Code Sector Architecture (Bottom)
Low Power CMOS, 1.0mA Standby
Embedded Erase and Program Algorithms
Built-in Decoupling Caps for Low Noise Operation
Erase Suspend/Resume
• Supports reading data from or programing data to a sector not being erased
Low Current Consumption Typical values at 5MHz:
• 40mA Active Read Current
• 80mA Program/Erase Current
Weight
    WF1M32B-XG2TX3 -8 grams typical
    WF1M32B-XHX3 -13 grams typical
Note: For programming information refer to Flash Programming 8M3 Application Note.


Pinout

Connection Diagram


Specifications

Parameter
Unit
Operating Temperature
-55 to +125
°C
Supply Voltage Range (Vcc)
-0.5 to +4.0
V
Signal Voltage Range
-0.5 to Vcc +0.5
V
Storage Temperature Range
-65 to +150
°C
Lead Temperature (soldering, 10 seconds)
+300
°C
Endurance (write/erase cycles)
1,000,000 min.
cycles
NOTES:
1. Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability.


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