Features: Package with DCB ceramic base plate Soldering connections for PCB mounting Isolation voltage 3600 V~ Low RDS(on) HDMOSTM process Low package inductance for high speed switching Ultrafast boost diode Kelvin source for easy driveApplication Power factor pre-conditioner for SMPS, UPS, ba...
VUM33-05: Features: Package with DCB ceramic base plate Soldering connections for PCB mounting Isolation voltage 3600 V~ Low RDS(on) HDMOSTM process Low package inductance for high speed switching Ultrafast ...
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Symbol |
Test Conditions |
Maximum Ratings |
VDSS VDGR VGS ID ID IDM PD IS ISM VRRM IdAV IFSM P VRRM IdAV IFSM P TVJ TJM Tstg VISOL Md Weight |
TVJ = 25 to 150 TVJ = 25 to 150; RGS = 10 k Continuous TS = 85 TS = 25 TS = 25, tp = o TS = 85 VGS = 0 V, TS = 25 VGS = 0 V, TS = 25, tp = o TS = 85, rectangular = 0.5 TVJ = 45, t = 10 ms (50 Hz) t = 8.3 ms (60 Hz) TVJ = 150, t = 10 ms (50 Hz) t = 8.3 ms (60 Hz) TS = 85 TS = 85, sinus 180o TVJ = 45, t = 10 ms (50 Hz) t = 8.3 ms (60 Hz) TVJ = 150,t = 10 ms (50 Hz) t = 8.3 ms (60 Hz) TS = 85 50/60 Hz t = 1 min IISOL 1 mA t = 1 s Mounting torque (M5) |
500 V 500 V ±20 V 33A 47A 130 A 310 W 33A 130 A 600 V 33 A 800 V 54 A 300 A 320 A 260 A 280 A 59W 300 A 320 A 260 A 280 A 50W -40...+150 150 -40...+150 3000 V~ 3600 V~ 2-2.5/18-22 Nm/lb.in. 28 g |