Features: Package with DCB ceramic base plate Soldering connections for PCB mounting Isolation voltage 3600 V~ Low RDS(on) HDMOSTM process Low package inductance for high speed switching Ultrafast boost diode Kelvin source for easy driveApplicationPower factor pre-conditioner for SMPS, UPS, batte...
VUM24-05: Features: Package with DCB ceramic base plate Soldering connections for PCB mounting Isolation voltage 3600 V~ Low RDS(on) HDMOSTM process Low package inductance for high speed switching Ultrafast ...
SeekIC Buyer Protection PLUS - newly updated for 2013!
268 Transactions
All payment methods are secure and covered by SeekIC Buyer Protection PLUS.
Symbol |
Test Conditions |
Maximum Ratings |
VDSS VDGR VGS ID ID IDM PD IS ISM VRRM IdAV IFSM P VRRM IdAV IFSM P TVJ TJM Tstg VISOL Md Weight |
TVJ = 25 to 150 TVJ = 25 to 150; RGS = 10 k Continuous TS = 85 TS = 25 TS = 25, tp = o TS = 85 VGS = 0 V, TS = 25 VGS = 0 V, TS = 25, tp = o TS = 85, rectangular = 0.5 TVJ = 45, t = 10 ms (50 Hz) t = 8.3 ms (60 Hz) TVJ = 150, t = 10 ms (50 Hz) t = 8.3 ms (60 Hz) TS = 85 TS = 85, sinus 180o TVJ = 45, t = 10 ms (50 Hz) t = 8.3 ms (60 Hz) TVJ = 150,t = 10 ms (50 Hz) t = 8.3 ms (60 Hz) TS = 85 50/60 Hz t = 1 min IISOL 1 mA t = 1 s Mounting torque (M5) |
500 V 500 V ±20 V 24A 35A 95 A 170 W 24A 95 A 600 V 40 A 300 A 320 A 260 A 280 A 36W 800 V 40 A 300 A 320 A 260 A 280 A 33W-40...+150 150 -40...+150 3000 V~ 3600 V~ 2-2.5/18-22 Nm/lb.in. 28 g |