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VTE1291W-1

ApplicationThis wide beam angle 5 mm plastic packaged emitter contains a double wirebonded, GaAlAs, 880 nm IRED chip. This cost effective design is well suited for dc or high current pulse applications. This device is a UL recognized component for smoke alarm applications (UL file #S3506).Specific...

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VTE1291W-1: ApplicationThis wide beam angle 5 mm plastic packaged emitter contains a double wirebonded, GaAlAs, 880 nm IRED chip. This cost effective design is well suited for dc or high current pulse applicati...

VTE1291W-1 Data Sheet

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Part Number:
VTE1291W-1
Supply Ability:
5000

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  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/21

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Product Details

Description



Application

This wide beam angle 5 mm plastic packaged emitter contains a double wirebonded, GaAlAs, 880 nm IRED chip. This cost effective design is well suited for dc or high current pulse applications. This device is a UL recognized component for smoke alarm applications (UL file #S3506).




Specifications

Maximum Temperatures
Storage and Operating:.............................................. -40°C to 100°C
Continuous Power Dissipation:............................................... 200 mW
Derate above 30°C: ..........................................................2.86 mW/°C
Maximum Continuous Current: .................................................100 mA
Derate above 30°C: ...........................................................1.43 mA/°C
Peak Forward Current, 10 µs, 100 pps: .......................................2.5 A
Temp. Coefficient of Power Output (Typ.): ...............................-.8%/°C
Maximum Reverse Voltage: ...........................................................5.0V
Maximum Reverse Current @ VR = 5V: ........................................10 µA
Peak Wavelength (Typical): ......................................................880 nm
Junction Capacitance @ 0V, 1 MHz (Typ.): ...................................23 pF
Response Time @ IF = 20 mA
Rise:1.0 µs Fall: ..........................................................................1.0 µs
Lead Soldering Temperature: .....................................................260°C
(1.6 mm from case, 5 seconds max.) 


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