VSMP0805

• Temperature coefficient of resistance (TCR):
     0.05 ppm/ typical (0 to + 60 )
     0.2 ppm/ typical (- 55 to + 125 , + 25 ref.)
• Tolerance: to ± 0.01 %
• Power coefficient ''R due to self heating'': 5 ppm at rated power
• Power rating: to 750 mW at + 70
• Load life stability: to ± 0.005 % at 70 , 2000 h at rated power
• Resistance range: 10 to 150 k (for higher and lower values, please contact us)
• Fast thermal stabilization < 1 s
• Electrostatic discharge (ESD) above 25 000 V
• Short time overload: 0.005 %
• Non inductive, non capacitive design
• Rise time: 1 ns without ringing
• Current noise: - 42 dB
• Voltage coefficient < 0.1 ppm/V
• Non inductive: < 0.08 H
• Non hot spot design
• Terminal finishes available: lead (Pb)-free
                                              tin/lead alloy
• Matched sets are available on request
• Any value available within resistance range (e.g. 1K2345)
• Screening per EEE-INST-002 is available for military and space
• Prototype samples available from 48 h. For more information, please contact foil@vishay.com
• For better performances please contact us

VSMP0805 Series is the industry's first device to provide High Rated power, Excellent load life stability along with extremely low TCR all in one resistor.

One of the most important parameters influencing stability is the Temperature Coefficient of Resistance (TCR). Although the TCR of foil resistors is considered extremely low, this characteristic has been further refined over the years. The VSMP Series utilizes ultra high precision Bulk Metal^® Z-Foil.

The Z-Foil technology provides a significant reduction of the resistive element's sensitivity to ambient temperature variations (TCR) and to self heating when power is applied (power coefficient). Along with the inherently low PCR and TCR, Z-Foil technology also provides remarkably improved load life stability, low noise and availability of tight tolerance. The VSMP has a full wraparound termination which ensures safe handling during the manufacturing process, as well as providing stability during multiple thermal cyclings.

Our Application Engineering Department is available to advise and make recommendations. For non-standard technical requirements and special applications, please contact us using the e-mail address in the footer below.