Features: • Package type: surface mount• Package form: PLCC-2• Dimensions (L x W x H in mm): 3.5 x 2.8 x 1.75• Peak wavelength: p = 850 nm• High reliability• High radiant power• High radiant intensity• Angle of half intensity: = ± 60°• Low for...
VSMG3700: Features: • Package type: surface mount• Package form: PLCC-2• Dimensions (L x W x H in mm): 3.5 x 2.8 x 1.75• Peak wavelength: p = 850 nm• High reliability• High...
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• Package type: surface mount
• Package form: PLCC-2
• Dimensions (L x W x H in mm): 3.5 x 2.8 x 1.75
• Peak wavelength: p = 850 nm
• High reliability
• High radiant power
• High radiant intensity
• Angle of half intensity: = ± 60°
• Low forward voltage
• Suitable for high pulse current operation
• High modulation band width: fc = 18 MHz
• Good spectral matching with Si photodetectors
• Floor life: 4 weeks, MSL 2a, acc. J-STD-020
• Lead (Pb)-free reflow soldering
• Lead (Pb)-free component in accordance with RoHS 2002/95/EC and WEEE 2002/96/EC
• Infrared radiation source for operation with CMOS cameras (illumination)
• High speed IR data transmission
PARAMETER | TEST CONDITION | SYMBOL | VALUE | UNIT |
Reverse voltage | VR | 5 | V | |
Forward current | IF | 100 | mA | |
Peak forward current | tp/T = 0.5, tp = 100 s | IFM | 200 | mA |
Surge forward current | tp = 100 s | IFSM | 1 | A |
Power dissipation | PV | 180 | mW |
VSMG3700 is an infrared, 850 nm emitting diode in GaAlAs double hetero (DH) technology with high radiant power and high speed, molded in a PLCC-2 package for surface mounting (SMD).