VSKV56

MECHANICAL DESCRIPTION
The Generation 5 of ADD-A-PAKTM module VSKV56 combine the excellent thermal performance obtained by the usage of direct bonded copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid copper baseplate at the bottom side of the device.

The Cu baseplate allow an easier mounting on the majority of heatsink with increased tolerance of surface roughness
and improved thermal spread.

The Generation 5 of ADD-A-PAK module VSKV56 is manufactured without hard mold, eliminating in this way any possible direct
stress on the leads.

The electrical terminals are secured against axial pull-out: they are fixed to the module housing via a click-stop feature
already tested and proved as reliable on other Vishay HPP modules.

ELECTRICAL DESCRIPTION
These modules are intended for general purpose high voltage applications such as high voltage regulated power supplies, lighting circuits, temperature and motor speed control circuits, UPS and battery charger.