VSKCS403

The Generation 5 of ADD-A-PAK module of VSKCS403 combine the excellent thermal performance obtained by the usage of direct bonded copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid copper baseplate at the bottom side of the device.

The Cu baseplate allow an easier mounting on the majority of heatsink with increased tolerance of surface roughness and improved thermal spread.

The Generation 5 of ADD-A-PAK module is manufactured without hard mold, eliminating in this way any possible direct stress on the leads.

The electrical terminals of VSKCS403 are secured against axial pull-out: they are fixed to the module housing via a click-stop feature  already tested and proved as reliable on other Vishay HPP modules.