VFB1012D

Bulk Metal^® Z-Foil Technology out-performs all other resistor technologies available today for applications that require ultra-high precision and ultra-high stability. The Z-Foil technology of VFB1012D provides a significant reduction of the resistive element's sensitivity to ambient temperature variations (TCR) and to self heating when power is applied (power coefficient).

Model VFB1012D offers low TCR (both absolute and tracking), low PCR (both absolute and tracking), excellent load life stability, tight tolerance, excellent ratio stability, and low current noise, all in one package. 0.05 ppm/  absolute TCR removes errors due to temperature gradients.

The VFB1012D Ball Grid Array (BGA) surface mount divider provides tight tolerance matching and TCR tracking between 2 resistors simultaneously etched on one piece of foil on a common substrate. The electrical specifications of this integrated construction offers improved performances and better real estate utilization over discrete resistors and matched pairs.

Our Application Engineering Department is available to advise and make recommendations. For non-standard technical requirements and special applications, please contact us.