Features: • Trench MOS Schottky technology • Low forward voltage drop, low power losses• High efficiency operation• Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package)• Solder dip 260 °C, 40 s (for TO-220AB, ITO-220AB and TO-262AA packag...
VF40120C: Features: • Trench MOS Schottky technology • Low forward voltage drop, low power losses• High efficiency operation• Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °...
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• Trench MOS Schottky technology
• Low forward voltage drop, low power losses
• High efficiency operation
• Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package)
• Solder dip 260 °C, 40 s (for TO-220AB, ITO-220AB and TO-262AA package)
• Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC
For use in high frequency inverters, switching power supplies, freewheeling diodes, OR-ing diode, dc-to-dc converters and reverse battery protection.
PARAMETER | SYMBOL | V40120C | VF40120C | VB40120C | VI40120C | UNIT |
Maximum repetitive peak reverse voltage | VRRM | 120 | V | |||
Maximum average forward rectified current (Fig. 1)per device per diode |
IF(AV) | 40 20 |
A | |||
Peak forward surge current 8.3 ms single half sine-wave superimposed on rated load |
IFSM | 250 | A | |||
Isolation voltage (ITO-220AB only) From terminal to heatsink t = 1 min |
VAC | 1500 | V | |||
Operating junction and storage temperature range | TJ, TSTG | - 40 to + 150 |