V60120C

Features: • Trench MOS Schottky technology• Low forward voltage drop, low power losses• High efficiency operation• Low thermal resistance• Solder dip 260, 40 s• Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/ECApplicationFor use in high frequency in...

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SeekIC No. : 004540097 Detail

V60120C: Features: • Trench MOS Schottky technology• Low forward voltage drop, low power losses• High efficiency operation• Low thermal resistance• Solder dip 260, 40 s• C...

floor Price/Ceiling Price

Part Number:
V60120C
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/25

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Product Details

Description



Features:

• Trench MOS Schottky technology
• Low forward voltage drop, low power losses
• High efficiency operation
• Low thermal resistance
• Solder dip 260, 40 s
• Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC






Application

For use in high frequency inverters, switching power supplies, freewheeling diodes, OR-ing diode, dc-to-dc converters and reverse battery protection.






Specifications

PARAMETER SYMBOL V60120C UNIT
Maximum repetitive peak reverse voltage VRRM 120 V
Maximum average forward rectified current (Fig.1)
per device IF(AV) 60 A
per diode 30
Peak forward surge current 10 ms single half
sine-wave superimposed on rated load per diode
IFSM 300
Peak repetitive reverse current per diode at tp = 2 µs, 1 kHz IRRM 1.0
Voltage rate of change (rated VR) dV/dt 10000 V/µs
Operating junction and storage temperature range TJ, TSTG - 40 to + 150





Description

V60120C datasheet




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