Features: • Trench MOS Schottky technology• Low forward voltage drop, low power losses• High efficiency operation• Low thermal resistance• Solder dip 260, 40 s• Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/ECApplicationFor use in high frequency in...
V60120C: Features: • Trench MOS Schottky technology• Low forward voltage drop, low power losses• High efficiency operation• Low thermal resistance• Solder dip 260, 40 s• C...
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• Trench MOS Schottky technology
• Low forward voltage drop, low power losses
• High efficiency operation
• Low thermal resistance
• Solder dip 260, 40 s
• Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC
For use in high frequency inverters, switching power supplies, freewheeling diodes, OR-ing diode, dc-to-dc converters and reverse battery protection.
PARAMETER | SYMBOL | V60120C | UNIT | |
Maximum repetitive peak reverse voltage | VRRM | 120 | V | |
Maximum average forward rectified current (Fig.1) |
per device | IF(AV) | 60 | A |
per diode | 30 | |||
Peak forward surge current 10 ms single half sine-wave superimposed on rated load per diode |
IFSM | 300 | ||
Peak repetitive reverse current per diode at tp = 2 µs, 1 kHz | IRRM | 1.0 | ||
Voltage rate of change (rated VR) | dV/dt | 10000 | V/µs | |
Operating junction and storage temperature range | TJ, TSTG | - 40 to + 150 |