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V48B12C150B_1163750

Features: • DC input range: 36 - 75V• Input surge withstand: 100V for 100ms• DC output: 12V• Programmable output: 10 to 110%• Regulation: ±0.2% no load to full load• Efficiency: 88%• Maximum operating temperature: 100 at full load• Power density: 91W...

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V48B12C150B_1163750: Features: • DC input range: 36 - 75V• Input surge withstand: 100V for 100ms• DC output: 12V• Programmable output: 10 to 110%• Regulation: ±0.2% no load to full loadR...

V48B12C150B_1163750 Data Sheet

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Part Number:
V48B12C150B_1163750
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/13

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Product Details

Description



Features:

• DC input range: 36 - 75V
• Input surge withstand: 100V for 100ms
• DC output: 12V
• Programmable output: 10 to 110%
• Regulation: ±0.2% no load to full load
• Efficiency: 88%
• Maximum operating temperature: 100 at full load
• Power density: 91W/cubic inch
• Height above board: 0.43 in. (10,9 mm)
• Parallelable, with N+M fault tolerance
• Low noise ZCS/ZVS architecture


Application

 telecommunications and distributed power systems




Specifications

Parameter
Rating
Unit
Notes
+In to In voltage
-0.5 to +75
Vdc
+In to In voltage
100
Vdc
<100ms
PC to In voltage
-0.5 to +7.0
Vdc
PR to In voltage
-0.5 to +7.0
Vdc
+Out to Out voltage
-0.5 to +16.1
Vdc
SC to Out voltage
-0.5 to +1.5
Vdc
Isolation voltage (in to out)
2000
Vrms
Isolation voltage (in to base)
1550
Vrms
Isolation voltage (out to base)
500
Vrms
Storage temperature (CGrade)
-40 to +125
See part numbering chart on this
page for other product grades.
Operating temperature (CGrade)
-20 to +100
Baseplate
Pin soldering temperature
500 (260)
°F()
<5 sec;wave solder
Pin soldering temperature
750 (390)
°F()
<7 sec;hand solder
Mounting torque
5 (0.57)
in-lbs (N-m)
6 each, # 4-40 or M3




Description

The V48B12C150B_1163750 uses 2nd Generation power processing, control and packaging technologies to provide the performance, flexibility and cost effectiveness expected of a mature power component. For example, a plated-cavity core transformer couples widely separated primary and secondary windings, resulting in low in-toout parasitic capacitance and noise. High frequency ZCS/ZVS switching, advanced power semiconductor packaging and thermal management provide high power density with low temperature gradients. Extensive use of silicon integration results in 1/3 the part count of a 1st Generation converter.




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