V24C12C100B

Type: Isolated
Number of Outputs: 1
Voltage - Output 2: -
Voltage - Output 3: -
Voltage - Output 1: 12V
Mounting Type: Through Hole
Packaging: Bulk
Voltage - Isolation: *
Features: *
Voltage - Input (Min): 18V
Voltage - Input (Max): 36V
Power (Watts) - Manufacture Series: 100W
Package / Case: Module
Efficiency: *
Manufacturer: Vicor Corporation
Operating Temperature: -20°C ~ 100°C
Current - Output (Max): *
Series: MICRO
Size / Dimension: 2.28" L x 1.45" W x 0.54" H (57.9mm x 36.8mm x 13.7mm)


Features:

• DC input range: 18 - 36V
• Input surge withstand: 50V for 100ms
• DC output: 12V
• Programmable output: 10 to 110%
• Regulation: ±0.2% no load to full load
• Efficiency: 85.8%
• Maximum operating temperature:100°C at full load
• Power density: 60W/cubic inch
• Height above board: 0.43 in. (10,9 mm)
• Parallelable, with N+M fault tolerance
• Low noise ZCS/ZVS architecture


Application

·telecommunications and distributed power systems

Specifications

Parameter	Rating	Unit	Notes
+In to In voltage	-0.5 to +36	Vdc
+In to In voltage	50	Vdc	<100ms
PC to In voltage	-0.5 to +7.0	Vdc
PR to In voltage	-0.5 to +7.0	Vdc
+Out to Out voltage	-0.5 to +16.1	Vdc
SC to Out voltage	-0.5 to +1.5	Vdc
Isolation voltage (in to out)	2000	Vrms
Isolation voltage (in to base)	1550	Vrms
Isolation voltage (out to base)	500	Vrms
Storage temperature (CGrade)	-40 to +125		See part numbering chart on this page for other product grades.
Operating temperature (CGrade)	-20 to +100		Baseplate
Pin soldering temperature	500 (260)	°F ()	<5 sec;wave solder
Pin soldering temperature	750 (390)	°F ()	<7 sec; hand solder
Mounting torque	5 (0.57)	in-lbs (N-m)	6 each, # 4-40 or M3

Description

This V24C12C100B uses 2nd Generation power processing, control and packaging technologies to provide the performance, flexibility and cost effectiveness expected of a mature power component.

For example, V24C12C100B, a plated-cavity core transformer couples widely separated primary and secondary windings, resulting in low in-toout parasitic capacitance and noise.

High frequency ZCS/ZVS switching, V24C12C100B, advanced power semiconductor packaging and thermal management provide high power density with low temperature gradients. Extensive use of silicon integration results in 1/3 the part count of a 1st Generation converter.