V24B12C200B

Type: Isolated
Number of Outputs: 1
Voltage - Output 2: -
Voltage - Output 3: -
Voltage - Output 1: 12V
Mounting Type: Through Hole
Packaging: Bulk
Voltage - Isolation: *
Features: *
Voltage - Input (Min): 18V
Voltage - Input (Max): 36V
Power (Watts) - Manufacture Series: 200W
Package / Case: Module
Efficiency: *
Manufacturer: Vicor Corporation
Operating Temperature: -20°C ~ 100°C
Current - Output (Max): *
Series: Mini
Size / Dimension: 2.28" L x 2.20" W x 0.54" H (57.9mm x 55.9mm x 13.7mm)


Features:

• DC input range: 18 - 36V
• Input surge withstand: 50V for 100ms
• DC output: 12V
• Programmable output: 10 to 110%
• Regulation: ±0.2%
• Efficiency: 85.8%
• Maximum operating temperature: 100°C at full load
• Power density: 80W/cubic inch
• Height above board: 0.43 in. (10,9 mm)
• Parallelable, with N+M fault tolerance
• Low noise ZCS/ZVS architecture


Specifications

Parameter	Rating	Unit	Notes
+In to In voltage +In to In voltage PC to In voltage PR to In voltage +Out to Out voltage SC to Out voltage Isolation voltage (in to out) Isolation voltage (in to base) Isolation voltage (out to base) Storage temperature (CGrade) Operating temperature (CGrade) Pin soldering temperature Pin soldering temperature Mounting torque	-0.5 to +36 50 -0.5 to +7.0 -0.5 to +7.0 -0.5 to +16.1 -0.5 to +16.1 1.0 -0.5 to +1.5 2000 1550 500 -40 to +125 -20 to +100 500 (260) 750 (390) 5 (0.57)	Vdc Vdc Vdc Vdc Vdc Vdc Vrms Vrms Vrms °F () °F () in-lbs (N-m)	<100ms Baseplate <5 sec; wave solder <7 sec; hand solder 6 each, # 4-40 or M3 See part numbering chart on this page for other product grades.

Description

This V24B12C200B uses 2nd Generation power processing, control and packaging technologies to provide the performance, flexibility and cost effectiveness expected of a mature power component. For example, a plated-cavity core transformer couples widely separated primary and secondary windings, resulting in low in-toout parasitic capacitance and noise. High frequency ZCS/ZVS switching, advanced power semiconductor packaging and thermal management provide high power density with low temperature gradients. Extensive use of silicon integration results in 1/3 the part count of a 1st Generation converter.