Features: • 3D foot design for improved press-fit retention and contact to host board holes• One-piece, stainless steel construction• Low emission design via fold-back spring fingers no openings for radiation to pass through• Enhanced transceiver kick-out springs• Sim...
V23838-S5-N1-BB: Features: • 3D foot design for improved press-fit retention and contact to host board holes• One-piece, stainless steel construction• Low emission design via fold-back spring finge...
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Features: • Compliant with existing standards• Compact integrated transceiver unit wit...
Features: • Compliant with existing standards• Compact integrated transceiver unit wit...
Features: • Compliant with existing standards• Compact integrated transceiver unit wit...
• Testing of rear connector may take place before SFP Cage is installed onto host board
• SFP cage mounting holes should be plated with HASL, gold, or immersion silver finish per MSA dimensional recommendations
• For double-sided mounting, host board thickness is .118 in [3.0 mm] minimum per the MSA. For belly-to-belly applications, three mounting feet are removed to avoid interference (V23838-S5-N1-BB)
• Supports any single sided, belly to belly, or offset belly to belly configuration with a minimum pitch of 16.25 mm
• Installation of the SFP cage should be done with a solid metal block across the top surface of the cage. Block dimensions to be controlled by customer
• Removal of the cage should be done with an internal solid metal block
• The Infineon SFP cage does not cause any damage when carefully removed; the outside profile of the 3D feet is smooth and will not destroy pre-plated host board mounting holes
• Trapped fluids from washing process must be dried to prevent corrosion beneath the SFP cage
• Cage retention depends on finished hole size and plating thickness
V23838-S5-N1-BB is offering its cage for Small Form-factor Pluggable (SFP) transceivers with one of the most rigid mechanical designs available on the market. The cage is designed for press fit applications in order to reduce high volume manufacturing effort. Externally bent bezel contact springs and one-piece construction enhance EMI performance.