V23809-C8-C10

Features: • Compliant with Fast Ethernet, FDDI, Fibre Channel, ATM/SONET/SDH standards• Compact integrated transceiver unit with duplex SC receptacle• Single power supply with 3.0 V to 5.5 V range• Extremely low power consumption < 0.7 W at 3.3 V• PECL differential...

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SeekIC No. : 004539600 Detail

V23809-C8-C10: Features: • Compliant with Fast Ethernet, FDDI, Fibre Channel, ATM/SONET/SDH standards• Compact integrated transceiver unit with duplex SC receptacle• Single power supply with 3.0 ...

floor Price/Ceiling Price

Part Number:
V23809-C8-C10
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/5/18

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Product Details

Description



Features:

• Compliant with Fast Ethernet, FDDI, Fibre Channel, ATM/SONET/SDH standards
• Compact integrated transceiver unit with duplex SC receptacle
• Single power supply with 3.0 V to 5.5 V range
• Extremely low power consumption < 0.7 W at 3.3 V
• PECL differential inputs and outputs
• System optimized for 62.5/50 µm graded index fiber
• Industry standard multisource footprint
• Very low profile for high slot density
• Wave solderable and washable with process plug inserted
• Testboard available
• UL-94 V-0 certified
• ESD Class 1 per MIL-STD 883D Method 3015.7 (March 89)
• Compliant with FCC (Class B) and EN 55022
• For distances of up to 2 km on multimode fiber



Application

• ATM switches/bridges/routers
• Fast Ethernet, FDDI
• High speed computer links
• Local area networks
• Switching systems



Specifications

Supply Voltage (VCCVEE)..................................... 0.5 V to 7 V
Data Input Levels (PECL) (VIN).................................... VEEVCC
Differential Data Input Voltage ........................................... 3 V
Operating Ambient Temperature (TAMB) ... ... ... ... 0°C to 85°C
Storage Ambient Temperature ......................... 40°C to 85°C
Soldering Conditions, Temp/Time (TSOLD/tSOLD)
     (MIL-STD 883C, Method 2003) .......................... 270°C/10s
ESD Resistance (all pins to VEE, human body) ................1.5 kV
Output Current (IO) .......................................................50 mA



Description

This data sheet describes the Infineon Fast Ethernet/FDDI/ATM transceiver-part of Infineon Multistandard Transceiver Family. V23809-C8-C10 is fully compliant with the Asynchronous Transfer Mode (ATM) OC-3 standard, the Fiber Distributed Data Interface (FDDI) Low Cost Fiber Physical Layer Medium Dependent (LCFPMD) draft standard(1), and the FDDI PMD standard(2).

V23809-C8-C10 was developed because of the need for multimedia applications, including real time transmission. The data rate is scalable and the ATM protocol is the basis of the broadband public networks being standardized in the International Telegraph and Telephone Consultative Committee (CCITT). ATM can also be used in local private applications.

FDDI is a Dual Token Ring standard developed in the U.S. by the Accredited National Standards Committee (ANSC) X3T9, within the Technical Committee X3T9.5. V23809-C8-C10 is applied to the local area networks of stations, transferring data at 100 Mbits/s with a 125 MBaud transmission rate. LCF FDDI is specially developed for short distance applications of up to 500 m (fiber-to-the-desk) as compared to 2 km for backbone applications.

Fast Ethernet was developed because of the higher bandwidth requirement in local area networking. It is based on the proven effectiveness of millions of installed Ethernet systems.

The Infineon multimode transceiver is a single unit comprised of a transmitter, a receiver, and an SC receptacle. This design frees the customer from many alignment and PC board layout concerns. The modules are designed for low cost applications.

The inputs/outputs of V23809-C8-C10 are PECL compatible and the unit operates from a 3.0 V to 5.5 V power supply. As an option, the data output stages can be switched to static levels during absence of light, as indicated by the Signal Detect function. It can be directly interfaced with available chipsets.




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