UT8CR512K32

Features: · 17ns maximum access time· Asynchronous operation for compatibility with industrystandard 512K x 8 SRAMs· CMOS compatible inputs and output levels, three-state bidirectional data bus- I/O Voltage 3.3 volts, 1.8 volt core· Radiation performance- Intrinsic total-dose: 300 Krad(Si)- SEL Im...

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SeekIC No. : 004539121 Detail

UT8CR512K32: Features: · 17ns maximum access time· Asynchronous operation for compatibility with industrystandard 512K x 8 SRAMs· CMOS compatible inputs and output levels, three-state bidirectional data bus- I/O...

floor Price/Ceiling Price

Part Number:
UT8CR512K32
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/22

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Product Details

Description



Features:

· 17ns maximum access time
· Asynchronous operation for compatibility with industrystandard 512K x 8 SRAMs
· CMOS compatible inputs and output levels, three-state bidirectional data bus
- I/O Voltage 3.3 volts, 1.8 volt core
· Radiation performance
- Intrinsic total-dose: 300 Krad(Si)
- SEL Immune >100 MeV-cm2/mg
- LETth (0.25): 53.0 MeV-cm2/mg
- Memory Cell Saturated Cross Section 1.67E-7cm2/bit
- Neutron Fluence: 3.0E14n/cm2
- Dose Rate
- Upset 1.0E9 rad(Si)/sec
- Latchup 1.0E11 rad(Si)/sec
· Packaging options:
- 68-lead ceramic quad flatpack (20.238 grams with lead frame)
· Standard Microcircuit Drawing 5962-04227
- QML compliant part



Pinout

  Connection Diagram


Specifications

SYMBOL PARAMETER
LIMITS
UNIT
VDD1 DC supply voltage -0.3 to 2.0 V
VDD2 DC supply voltage
-0.3 to 3.8
V
VIO Voltage on any pin
-0.3 to 3.8
V
II DC input current
±5
mA
TSTG Storage temperature
-65 to +150
°C
PD Maximum power dissipation2
1.2
W
TJ Maximum junction temperature
+150
°C
QJC Thermal resistance, junction-to-case3
5
°C/W

Note:
1. Stresses outside the listed absolute maximum ratings may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at these or any other conditions beyond limits indicated in the operational sections of this specification is not recommended. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
2. Maximum junction temperature may be increased to +175°C during burn-in and steady-static life.
3. Test per MIL-STD-883, Method 1012.




Description

The UT8CR512K32 is a high-performance CMOS static RAM multi-chip module (MCM), organized as four individual 524,288 words by 8 bit SRAMs with common output enable. Easy memory expansion is provided by active LOW chip enables (EN), an active LOW output enable (G), and three-state drivers. This device has a power-down feature that reduces power consumption by more than 90% when deselected.

Writing to each memory of UT8CR512K32 is accomplished by taking the corresponding chip enable (En) input LOW and write enable (Wn) input LOW. Data on the I/O pins is then written into the location specified on the address pins (A0 through A18). Reading from the device is accomplished by taking the chip enable (En) and output enable (G) LOW while forcing write enable (Wn) HIGH. Under these conditions, the contents of the memory location specified by the address pins will appear on the I/O pins.

The input/output pins of UT8CR512K32 are placed in a high impedance state when the device is deselected (En HIGH), the outputs are disabled (G HIGH), or during a write operation (En LOW and Wn LOW). Perform 8, 16, 24 or 32 bit accesses by making Wn along with En a common input to any combination of the discrete memory die.




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