USCD024

Features: * Lead free product* Leadless chip form , no lead damage* Lead-free solder joint , no wire bond & lead frame* Plastic package has Underwriters Laboratory Flammability Classification 94V-0* For surface mounted applications* Low profile package* Built-in strain relief* Metal to silicon...

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USCD024 Picture
SeekIC No. : 004538847 Detail

USCD024: Features: * Lead free product* Leadless chip form , no lead damage* Lead-free solder joint , no wire bond & lead frame* Plastic package has Underwriters Laboratory Flammability Classification 94...

floor Price/Ceiling Price

Part Number:
USCD024
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Month Sales

268 Transactions

Rating

evaluate  (4.8 stars)

Upload time: 2025/1/4

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Product Details

Description



Features:

* Lead free product
* Leadless chip form , no lead damage
* Lead-free solder joint , no wire bond & lead frame
* Plastic package has Underwriters Laboratory Flammability Classification 94V-0
* For surface mounted applications
* Low profile package
* Built-in strain relief
* Metal to silicon rectifier , majority carrier conduction
* Low power loss , High efficiency
* High current capability , low VF
* High surge capacity
* For using in low voltage high frequency switching power supply, inverters , free wheeling , and polarity protection applications



Specifications

Ratings at 25 ambient temperature
unless otherwise specified.
SYMBOLS
USCD022
USCD024
UNITS
Maximum repetitive peak reverse voltage
VRRM
20
40
Volts
Maximum RMS Voltage
VRMS
14
28
Volts
Maximum DC Blocking Voltage
VDC
20
40
Volts
Average Forward Rectified Current
IO
200
mA
Peak Forward Surge Current at 8.3 ms single half
sine-wave
IFSM
2.0
Amps
Maximum Instantaneous Forward Voltage at 0.2 A
VF
0.45
Volts
Maximum DC Reverse Current at Rated DC Blocking Voltage
IR
50
uA
Maximum DC Reverse Current at 10 V
IR
30
uA
Junction Temperature
TJ
+125
Storage temperature range
TSTG
-40 to +125



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