USBLC6-2

The USBLC6-2P6 and USBLC6-2SC6 are two monolithic Application Specific Devices dedicated to ESD protection of high speed interfaces such as USB2.0, Ethernet links and Video lines.

The very low line capacitance secures a high level of signal integrity without compromising in protection sensitive chips against the most stringent characterized ESD strikes.

Here is the description about USBLC6-2 of the very low capacitance ESD protection. The USBLC6-2SC6 and USBLC6-2P6 are monolithic application specific devices dedicated to ESD protection of high speed interfaces, such as USB 2.0, Ethernet links and video lines. The very low line capacitance secures a high level of signal integrity without compromising in protecting sensitive chips against the most stringent characterized ESD strikes.
Here are the features: 2 data lines protection; 2 data lines protection; Very low capacitance: 3.5 pF max; Very low leakage current: 150 nA max; SOT-666 and SOT23-6L packages;RoHS compliant.
Here are the absolute Maximum Ratings and Electrical characteristics (TA = 25). Storage temperature range is from -55 to +150°C. Operating junction temperature range is from -40 to +125°C. Lead solder temperature is (10 seconds duration) 260°C. Reverse stand-off voltage is 5V. Leakage current is 150nA. Breakdown voltage between VBUS and GND is 6V. Forward voltage is 1.1V. Clamping voltage is 12V (IPP = 1A) and 17V (IPP = 5 A). Capacitance between I/O and GND is 3.5pF. Capacitance between I/O is 1.7pF.
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