Features: • Ideal for surface mount pick and place application• Low profile package• Built-in strain relief• High surge capability• Glass passivated chip• Ultra fast recovery for high efficiency• High temperature soldering guaranteed: 260oC/10sec/at termin...
US2AA: Features: • Ideal for surface mount pick and place application• Low profile package• Built-in strain relief• High surge capability• Glass passivated chip• Ultra f...
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Characteristic |
SYMBOLS |
US2 AB |
US1 BB |
US2 DB |
US2 GB |
US2 JB |
US2 KB |
US2 MB |
UNITS |
Maximum Repetitive Peak Reverse Voltage | VRRM | 50 | 100 | 200 | 400 | 600 | 800 | 1000 |
V |
Maximum RMS Voltage |
VRMS |
35 |
70 |
140 |
280 |
420 |
560 |
700 |
V |
Maximum DC Blocking Voltage | VDC | 50 | 100 | 200 | 400 | 600 | 800 | 1000 | V |
Average Rectified Output Current @TL = 90°C |
IF(AV) |
2.0 |
A | ||||||
Peak Forward Surge Current (8.3ms single half sine-wave superimposed on rated load) |
IFSM |
50 |
A | ||||||
Maximum Instantaneous Forward Voltage (at rated forward current) |
VF |
1.0 |
1.4 |
1.7 |
V | ||||
Peak Reverse Current @TA = 25°C At Rated DC Blocking Voltage @TA = 100°C |
IR |
5.0 350 |
A | ||||||
Reverse Recovery Time (Note 1) |
trr |
50 |
75 |
nS | |||||
Typical Junction Capacitance (Note 2) |
Cj |
25 |
25 |
pF | |||||
Typical Thermal Resistance (Note 3) |
RJL |
20 |
oC/W | ||||||
Operating and storage temperature range |
TJ, TSTG |
-50 to +150 |
°C |