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US1AB

Features: • Ideal for surface mount pick and place application• Low profile package• Built-in strain relief• High surge capability• Glass passivated chip• Ultra fast recovery for high efficiency• High temperature soldering guaranteed: 260oC/10sec/at termin...

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SeekIC No. : 004538606 Detail

US1AB: Features: • Ideal for surface mount pick and place application• Low profile package• Built-in strain relief• High surge capability• Glass passivated chip• Ultra f...

US1AB Data Sheet

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Part Number:
US1AB
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/22

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Product Details

Description



Features:

• Ideal for surface mount pick and place application
• Low profile package
• Built-in strain relief
• High surge capability
• Glass passivated chip
• Ultra fast recovery for high efficiency
• High temperature soldering guaranteed: 260oC/10sec/at terminal


Specifications

Characteristic
SYMBOLS
 US1
AB		 US1
BB		 US1
DB		 US1
GB		 US1
JB		 US1
KB		 US1
MB
UNITS
Maximum Repetitive Peak Reverse Voltage VRRM 50 100 200 400 600 800 1000
V
Maximum RMS Voltage
VRMS
35
70
140
280
420
560
 700
V
Maximum DC Blocking Voltage VDC 50 100 200 400 600 800 1000 V
Average Rectified Output Current @TL = 100°C
IF(AV)
1.0
A
Peak Forward Surge Current (8.3ms single
half sine-wave superimposed on rated load)
IFSM
30
A
Maximum Instantaneous Forward Voltage
(at rated forward current)
VF
1.0
1.4
1.7
V
Peak Reverse Current @TA = 25°C
At Rated DC Blocking Voltage @TA = 100°C
IR
5.0
200
A
Reverse Recovery Time (Note 1)
trr
50
75
nS
Typical Junction Capacitance (Note 2)
Cj
20
 10
pF
Typical Thermal Resistance (Note 3)
RJL
32
oC/W
Operating and storage temperature range
TJ, TSTG
-50 to +150
°C
Note:
1.Reverse recovery condition IF=0.5A, IR=1.0A,Irr=0.25A.
2.Measured at 1.0 MHz and applied voltage of 4.0Vdc
3.Thermal resistance from junction to terminal mounted on 5*5mm copper pad area


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