Features: `For surface mounted applications`Low profile package`Ideal for automated placement`Glass Passivated Chip Junction`High temperature soldering : 260 / 10 seconds at terminals`Pb free product : 99% Sn can meet RoHS environmentsubstance directive requestSpecifications PARAMETER Sy...
US1008FL: Features: `For surface mounted applications`Low profile package`Ideal for automated placement`Glass Passivated Chip Junction`High temperature soldering : 260 / 10 seconds at terminals`Pb free produc...
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PARAMETER |
Symbol |
US1001FL |
US1002FL |
US1004FL |
US1006FL |
US1008FL |
Units |
Marking Code |
U1B |
U1D |
U1G |
U1J |
U1K |
||
Maximum repetitve peak reverse voltage |
VRRM |
100 |
200 |
400 |
600 |
800 |
V |
Maximum RMS voltage |
VRMS |
70 |
140 |
280 |
420 |
560 |
V |
Maximum DC blocking voltage |
VDC |
100 |
200 |
400 |
600 |
800 |
V |
Maximum average forward rectified current Ttp=65 TA=45 |
LF(AV) |
1.4 0.5 |
A | ||||
Maximum DC reverse current at rated DC blocking voltage TA=25 TA=125 |
IR |
10 50 |
A | ||||
Operating junction and storage temperature range |
TJ,TSTG |
-50 TO+150 |