Features: ·Low Thermal Resistance ·Rugged Optomite 0603 package ·High Brightness ·No UV bleed through ·Broad angular Luminous Emission ·Suited for high reliability applicationsApplication ·Mobil Phone Keypad ·Panel, button, swi...
UPWLEDxx: Features: ·Low Thermal Resistance ·Rugged Optomite 0603 package ·High Brightness ·No UV bleed through ·Broad angular Luminous Emission ·S...
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Parameters |
Symbol |
Value |
Unit DC |
Forward Drive Current |
IF |
30 |
mA |
Peak Forward Current |
IFP |
100 |
mA |
LED Operating Junction Temperature |
Tj |
-40 to +150 |
mW |
Reverse Voltage |
VR |
8 |
V |
Power Dissipation |
PD |
125 |
V |
Operating Temperature |
TOPR |
-40 to +125 |
|
Storage Temperature |
TS |
-40 to +150 |
|
Electrostatic Discharge |
ESD |
1000 |
|
ESD classification |
Class 2 |
V |
The UPWLEDxx product incorporates Microsemi's unique, patented packaging concept to improve the homogeneous distribution of white light. The Optomite package has low thermal resistance, <130°C/W. The UPWLEDxx package gives a broad luminous emission, >170°. The packaging characteristics lend themselves to increased life, critical to many white applications.