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UPS115U

Features: Low Profile Maximum height of 1.1 mmFootprint Area of 10 mm2Low VF Provides Higher EfficiencyLow Thermal Resistance with Direct Thermal Path of Die on Exposed Cathode Heat SinkSupplied in 8mm Tape and Reel 3,000 units/7 Reel; 12,000 units/13 ReelApplicationHigh power Surface Mount Pa...

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SeekIC No. : 004538408 Detail

UPS115U: Features: Low Profile Maximum height of 1.1 mmFootprint Area of 10 mm2Low VF Provides Higher EfficiencyLow Thermal Resistance with Direct Thermal Path of Die on Exposed Cathode Heat SinkSupplied in...

UPS115U Data Sheet

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Part Number:
UPS115U
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/25

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Product Details

Description



Features:

Low Profile Maximum
    height of 1.1 mm
Footprint Area of 10 mm2
Low VF Provides Higher
    Efficiency
Low Thermal Resistance
    with Direct Thermal Path
    of Die on Exposed
    Cathode Heat Sink
Supplied in 8mm Tape
    and Reel 3,000 units/7"
    Reel; 12,000 units/13" Reel


Application

High power Surface Mount
   Package
Guard Ring Protection
Ultra Low forward voltage
Integral Heat Sink/Locking Tabs
Compatible with Automatic
   Insertion Equipment
Full Metallic Bottom Eliminates
   Flux Entrapment
High Surge Capacity
Ideal for OR'ing Diode


Specifications

RATING
 (Conditions)
SYMBOL
VALUE
UNIT
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
15
15
V
V
V
Average Rectified Forward Current (@ Rated VR and TL = 65°C)
IO
1.0
A
Repetitive Peak Surge Current (Non-Repetitive peak surge current
@ IO = 1.0Amps )
IFSM
50
A
Storage Temperature Range
Tstg, TC
-55 to 150
°C
Operating Temperature Range
TJ
-55 to 100
°C
Voltage Rate of Change (@ Rated VR and TJ = 25°C)
dv/dt
1000
V/ms
Max Peak Reverse Current (VRRM = 15V, TJ = 25ºC)
IRM
10
mA



Description

In Microsemi's new Powermite SMT Package, these high efficiency Schottky rectifiers offer power handling capabilities previously found only in much larger packages. They are ideal for SMD applications that operate at high frequencies.

In addition to its size advantages, Powermite package features include a full metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an integral heat sink. Its innovative design makes this device ideal for use with automatic insertion equipment




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