Features: ·High Power Surface Mount Package·Ultra-fast Recovery Time (30ns)·Low Forward Voltage·Compatible with Automatic Insertion Equipment·Full Metallic Bottom Eliminates Flux Entrapment·Integral Heat / Sink/Locking TabsApplication·Switching and Regulating Power Supplies·Charge Pump Circuits·Re...
UPR60: Features: ·High Power Surface Mount Package·Ultra-fast Recovery Time (30ns)·Low Forward Voltage·Compatible with Automatic Insertion Equipment·Full Metallic Bottom Eliminates Flux Entrapment·Integral...
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Maximum Reverse Voltage |
600V |
Average Power Dissipation @ TTab = 75 |
2.5W* |
Thermal Resistance Junction to Tab |
30/W |
Thermal Resistance Junction to Bottom |
10/W |
Non-Repetitive Sinusoidal Surge Current (8.3mS) |
20A |
Operating and Storage Temperature |
-55º to + 150 |
* WHEN MOUNTED ON A PC BOARD WITH 2 OZ. COPPER. |
Microsemi's Powermite SMT package offers high efficiency ultra fast rectifiers with the power handling capabilities previously found only in much larger packages. They are ideal for SMD applications that operate at high frequencies.
The Powermite package's full metallic bottom eliminates the possibility of solder flux entrapment during assembly, and its unique locking tab acts as an integral heat sink. Its innovative design makes this device ideal for use with automatic insertion equipment.