UPGA301Ae3

Features: 􀂃· Very low thermal resistance package􀂃· Efficient heat path with integral locking bottom metal tab􀂃· Full metallic bottom eliminates flux entrapment􀂃· RoHS Compliant with e3 suffix􀂃· High speed switching capability􀂃· Compatible with ...

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SeekIC No. : 004538374 Detail

UPGA301Ae3: Features: 􀂃· Very low thermal resistance package􀂃· Efficient heat path with integral locking bottom metal tab􀂃· Full metallic bottom eliminates flux entrapment􀂃· ...

floor Price/Ceiling Price

Part Number:
UPGA301Ae3
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Month Sales

268 Transactions

Rating

evaluate  (4.8 stars)

Upload time: 2025/1/4

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Product Details

Description



Features:

􀂃· Very low thermal resistance package
􀂃· Efficient heat path with integral locking bottom metal tab
􀂃· Full metallic bottom eliminates flux entrapment
􀂃· RoHS Compliant with e3 suffix
􀂃· High speed switching capability
􀂃· Compatible with high-speed insertion
􀂃· Low profile height of 1 mm



Application

􀂃` Reference Microsemi MicroNote 601 and 602
􀂃` Nanosecond SCR switch for reliable high current pulse generators, modulators and photo-flash quenching
􀂃` Logic drive capability (0.8V, 200A)
􀂃` Ideal for Laser Range finder and Camera Applications
􀂃` Ideal for Automotive Collision Avoidance Applications



Specifications

Rating Symbol Value Unit
Repetative peak Off-State Voltage VDRM 100 V
Peak On-State Current for 50 ns (max) ITSM 100 A
Peak Gate Current IGM 250 mA
Reverse Gate Voltage VGR 5 V
Storage Temperature Range T s -50 to 150 °C
Operating Temperature Range T J 0 to 125 °C



Description

The UPGA301Ae3 is Designed for high current narrow-pulse switching applications where size and current handling capability are critical.

These devices UPGA301Ae3 may be triggered on using low power logic drivers from (+0.8 V at 200 A).

Epoxy packaged, oxide passivated planar SCR chips with metallurgic bonds on both sides to achieve high reliability. Internal wire bond connection allows high current surge capability for narrow pulse applications.




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