UPG2151T5K

Features: • SWITCH CONTROL VOLTAGE: Vcont (H) = 1.8 to 5.3 V (3.0 V TYP.) Vcont (L) = −0.2 to +0.2 V (0 V TYP.)• LOW INSERTION LOSS: 0.30 dB TYP. @ 0.5 to 1.0 GHz 0.35 dB TYP. @ 1.0 to 2.0 GHz 0.40 dB TYP. @ 2.0 to 2.5 GHz 0.50 dB TYP. @ 2.5 to 3.0 GHz• HIGH ISOLATION: 25 ...

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SeekIC No. : 004538361 Detail

UPG2151T5K: Features: • SWITCH CONTROL VOLTAGE: Vcont (H) = 1.8 to 5.3 V (3.0 V TYP.) Vcont (L) = −0.2 to +0.2 V (0 V TYP.)• LOW INSERTION LOSS: 0.30 dB TYP. @ 0.5 to 1.0 GHz 0.35 dB TYP. @ 1...

floor Price/Ceiling Price

Part Number:
UPG2151T5K
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/1/4

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Product Details

Description



Features:

• SWITCH CONTROL VOLTAGE:
   Vcont (H) = 1.8 to 5.3 V (3.0 V TYP.)
   Vcont (L) = −0.2 to +0.2 V (0 V TYP.)
• LOW INSERTION LOSS:
   0.30 dB TYP. @ 0.5 to 1.0 GHz
   0.35 dB TYP. @ 1.0 to 2.0 GHz
   0.40 dB TYP. @ 2.0 to 2.5 GHz
   0.50 dB TYP. @ 2.5 to 3.0 GHz
• HIGH ISOLATION:
   25 dB TYP. @ 0.5 to 1.0 GHz
   18 dB TYP. @ 1.0 to 2.0 GHz
   17 dB TYP. @ 2.0 to 2.5 GHz
   13 dB TYP. @ 2.5 to 3.0 GHz
• POWER HANDLING:
   Pin (1 dB) = +27.0 dBm TYP. @ 0.5 to 3.0 GHz, Vcont (H) = 3.0 V/0 V
• HIGH-DENSITY SURFACE MOUNTING:
   6-pin TSON package (1.0 × 1.0 × 0.4 mm)
• Pb FREE



Application

• Cellular and cordless telephones
• BluetoothTM , ZigBee
• Short Range Wireless
• Alternative to die usage



Pinout

  Connection Diagram


Specifications

PARAMETER
SYMBOL
RATINGS
UNIT
Switch Control Voltage
Vcont
+6.0 Note
V
Input Power
Pin
+30
dBm
Operating Ambient Temperature
TA
−45 to +85
°C
Storage Temperature
Tstg
−55 to +150
°C
Note |Vcont1-Vcont2| 6.0 V


Description

NEC's UPG2151T5K is a GaAs MMIC L, S-band SPDT switch for mobile phones and other L, S-band size restricted applications.

This device can operate from 0.5 to 3 GHz with low insertion loss and high isolation.

The UPG2151T5K is housed in a 6-pin Pb Free low profile package suitable for high-density surface mounting, and is a packaged alternative to die for usage in modules.




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