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UPG2012TB

RF Switch ICs RO 551-UPG2012TB-A

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SeekIC No. : 00632361 Detail

UPG2012TB: RF Switch ICs RO 551-UPG2012TB-A

UPG2012TB Data Sheet

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Part Number:
UPG2012TB
Mfg:
NEC/CEL
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Quick Details

Mounting Style : SMD/SMT Package / Case : SOT-363    

Description

Number of Switches :
Switch Configuration :
Insertion Loss :
Off Isolation (Typ) :
Maximum Operating Temperature :
Minimum Operating Temperature :
Packaging :
Mounting Style : SMD/SMT
Package / Case : SOT-363


Features:

· SUPPLY VOLTAGE:
    VDD = 2.7 to 3.0 V (2.8 V TYP.)
· SWITCH CONTROL VOLTAGE:
    Vcont (H) = 2.7 to 3.0 V (2.8 V TYP.)
    Vcont (L) = −0.2 to +0.2 V (0 V TYP.)
· LOW INSERTION LOSS:
   LINS1 = 0.27 dB TYP. @ f = 0.5 to 1.0 GHz, VDD = 2.8 V, Vcont = 2.8 V/0 V
   LINS2 = 0.30 dB TYP. @ f = 2.0 GHz, VDD = 2.8 V, Vcont = 2.8 V/0 V
   LINS3 = 0.35 dB TYP. @ f = 2.5 GHz, VDD = 2.8 V, Vcont = 2.8 V/0 V
   (Reference value)
· HIGH ISOLATION:
   ISL1 = = 28 dB TYP. @ f = 0.5 to 2.0 GHz, VDD = 2.8 V, Vcont = 2.8 V/0 V
   ISL2 = 25 dB TYP. @ f = 2.5 GHz, VDD = 2.8 V, Vcont = 2.8 V/0 V
   (Reference value)
· HIGH-DENSITY SURFACE MOUNTING:
   6-pin super minimold package (2.0 × 1.25 × 0.9 mm)


Application

· L-band digital cellular or cordless handsets
· PCS, W-LAN, WLL and BluetoothTM
· Short Range Wireless


Pinout

Connection Diagram


Specifications

Parameter
Symbol
Ratings
Unit
Supply Voltage
VDD
6.0
V
Switch Control Voltage
Vcont
+6.0
V
Input Power
Pin
+26
dBm
Power Dissipation
PD
150Note
mW
Operating Ambient Temperature
TA
−45 to +85
°C
Storage Temperature
Tstg
−55 to +150
°C
Note Mounted on double-sided copper-clad 50 × 50 × 1.6 mm epoxy glass PWB, TA = +85°C


Description

NEC's UPG2012TB is a single control GaAs MMIC L-band SPDT (Single Pole Double Throw) switch for mobile phone and L-band applications.

This device UPG2012TB can operate from 0.5 to 2.5 GHz, with low insertion loss and high isolation.

This device UPG2012TB is housed in a 6-pin super minimold package, suitable for high-density surface mounting.




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