Features: `POWERMITE 3 Surface Mount Package`Low On-State Resistance`High Frequency Switching`Ultra Low Leakage current`Integral Heat Sink / LockingTabs`Supplied in 16mm Tape and Reel 6000 units/reel`Superior Low Thermal And Electrical capabilityApplication• Motor Control• Switch Mode...
UPF1N50: Features: `POWERMITE 3 Surface Mount Package`Low On-State Resistance`High Frequency Switching`Ultra Low Leakage current`Integral Heat Sink / LockingTabs`Supplied in 16mm Tape and Reel 6000 units/re...
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UPF1N50 Power MOSFET in ultra low profile patented Powermite 3(TM) package provides the designer with the best combination of fast Switching, ruggedized device design, low on-resistance, cost effectiveness in the industry's smallest high power surface mount package.
The UPF1N50 is ideal for ultra small motor control and switch mode power supply applications.
The UPF1N50 Powermite 3 is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. With power dissipation levels up to 1.8 Watts, the Powermite 3 offers similar power handling capability to device 4 times its size by using a patented full metal wrap around bottom.