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UPC8179TK

RF Amplifier Lo-Current Amplifier

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SeekIC No. : 00613414 Detail

UPC8179TK: RF Amplifier Lo-Current Amplifier

UPC8179TK Data Sheet

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Part Number:
UPC8179TK
Mfg:
NEC/CEL
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/22

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Product Details

Description

Type :
Operating Frequency :
Noise Figure :
Bandwidth :
Output Intercept Point :
Operating Supply Voltage :
Supply Current :
Maximum Operating Temperature :
Mounting Style :
Package / Case :
Packaging :


Features:

• HIGH DENSITY SURFACE MOUNTING:
  6 Pin Leadless Minimold Package (1.5 x 1.1 x 0.55 mm)
• SUPPLY VOLTAGE:
  VCC = 2.4 to 3.3 V
• HIGH EFFICIENCY:
  PO(1dB) = +2.0 dBm TYP at f = 1.0 GHz
  PO(1dB) = +0.5 dBm TYP at f = 1.9 GHz
  PO(1dB) = +0.5 dBm TYP at f = 2.4 GHz
• POWER GAIN:
  GP = 13.5 dB TYP at f = 1.0 GHz
  GP = 15.5 dB TYP at f = 1.9 GHz
  GP = 16.0 dB TYP at f = 2.4 GHz
• EXCELLENT ISOLATION:
  ISL = 43 dB TYP at f = 1.0 GHz
  ISL = 42 dB TYP at f = 1.9 GHz
  ISL = 42 dB TYP at f = 2.4 GHz
• LOW CURRENT CONSUMPTION:
  ICC = 4.0 mA TYP AT VCC = 3.0 V
• OPERATING FREQUENCY:
  0.1 to 2.4 GHz (Output port LC matching)
• LIGHT WEIGHT: 3 mg


Application

• Buffer amplifiers for 0.1 to 2.4 GHz mobile communications systems.


Pinout

Connection Diagram


Specifications

SYMBOLS PARAMETERS UNITS RATINGS
VCC Supply Voltage V 3.6
ICC Circuit Current mA 15
PD Power Dissipation2 mW 232
TOP Operating Temperature °C -40 to +85
TSTG Storage Temperature °C -55 to +150
PIN Input Powe dBm +5
Notes:
1. Operation in excess of any one of these parameters may result in permanent damage.
2. Mounted on a 50 x 50 x 1.6 mm epoxy glass PWB (TA = +85°C).


Description

NEC's UPC8179TK is a silicon monolithic integrated circuit designed as an amplifier for mobile communications. This IC can realize low current consumption with external chip inductor. The incorporation of a chip identical to the conventional 6- pin super minimold package (2.0 x 1.25 x 0.9 mm) µPC8179TB in a 6-pin leadless minimold package (1.5 x 1.1 x 0.55 mm) has enabled a reduction in mounting area of 50 %. The µPC8179TK is ideally suited to replace the µPC8179TB for footprint reduction and increased design density. This IC is manufactured using NEC's 30 GHz fMAX UHS0 (Ultra High Speed Process) silicon bipolar process. This process uses direct silicon nitride passivation film and gold electrodes. These materials can protect the chip surface from pollution and prevent corrosion/ migration. Thus this IC has excellent performance uniformity and reliability.

NEC's stringent quality assurance and test procedures assure the highest performance. consistency and reliability.




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