UPC2745

The UPC2745 is a silicon monolithic integrated circuits designed as buffer amplifier for mobile communications.The IC is packaged in super minimold package which is smaller than conventional minimold.The IC is manufactured using NEC's 20 GHz fT silicon bipolar process.This process uses silicon nitride passivation film and gold electrodes.These materials can protect chip surface from external pollution and prevent corrosion/migration.Thus, these IC have excellent performance,uniformity and reliability.

Features of the UPC2745 are:(1)high-density surface mounting:6pin super minimold package;(2)supply voltage:recommended VCC=2.7 to 3.3 V;(3)2-bit parallel mode select,circuit operation VCC=1.8 to 3.3 V;(4)wideband response:fu=2.7 GHzTYP;(5)high isolation:ISL=38dBTYP.

The absolute maximum ratings of the UPC2745 can be summarized as:(1):the parameter is supply voltage,the symbol is VCC,the rating is 4.0,the unit is V;(2):the parameter is circuit current,the symbol is ICC,the rating is 16,the unit is mA;(3):the parameter is input power level,the symbol is Pin,the rating is 0,the unit is dBm;(4):the parameter is total power dissipation,the symbol is PD,the rating is 200,the unit is mW;(5):the parameter is operating ambient temperature,the symbol is Topt,the rating is -40 to +85,the unit is ;(6):the parameter is storage temperature,the symbol is Tstg,the rating is -55 to +150,the unit is .