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UMA5817

Features: • Plastic package has Underwriters Laboratory Flammability classification 94V-0• Metal to silicon rectifier, majority carrier conduction• High current capability, low VF• Built-in stress relief with similar COE as PC boards• Optional Lead-Free design/finish ...

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SeekIC No. : 004537237 Detail

UMA5817: Features: • Plastic package has Underwriters Laboratory Flammability classification 94V-0• Metal to silicon rectifier, majority carrier conduction• High current capability, low VF&...

UMA5817 Data Sheet

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Part Number:
UMA5817
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/21

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Product Details

Description



Features:

• Plastic package has Underwriters Laboratory Flammability classification 94V-0
• Metal to silicon rectifier, majority carrier conduction
• High current capability, low VF
• Built-in stress relief with similar COE as PC boards
• Optional Lead-Free design/finish (UMAF5817-19)
• Options for screening in accordance with MIL-PRF-19500/586 for JAN, JANTX, JANTXV, and JANS are available by adding MQ, MX, MV, or MSP prefixes respectively to part numbers. For example, designate a MXUMAJ5819 for a JANTX screen.


Application

• For surface mount applications
• For use in low-voltage high-frequency switching power supplies, inverters, free wheeling, and polarity protectionapplications
• Low power loss, High efficiency
• Low inductive parasitics for minimal Ldi/dt effects
• Fits same small PCB footprints as popular "SMAJxxx" or "SMBJxxx" Schottky devices in JEDEC outlines DO 214AC (or BA) and DO-214AA respectively except with much lower height profile
• Robust 2010 MELF style package configuration for pick-and-place handling


Specifications

• Operating junction and storage temperature range (TJ and TSTG): -50 oC to +125oC
• Forward average rectified current (IO) @TC=75oC: 1.0 Amp
• Forward surge current (IFSM) 8.3 ms single half-sine waveform superimposed on rated load (JEDEC Method): 25Amps
• Typical thermal resistance (RJL): 50 oC/W
• Typical junction capacitance (CJ) at 1.0 MHz and VR of 5.0 Volts: 65 pF for UMA5817, and 46 pF for UMA5818 and UMA5819
• Solder temperatures: 260 ºC for 10 s (maximum)


Description

The UMA5817 thru UMA5819 UltraMite™ series offers small efficient surface mount packaging with the same electrical features as the popular 1N5817, 1N5818, and 1N5819 Schottky rectifiers. It provides the same size footprint as other small surface mount DO-214AC or BA package options except with a much lower profile height. Its configuration in a "2010 MELF" style robust package design prevents lead damage to terminals and also minimizes parasitics by eliminating internal wire bonds and providing very short internal conduction paths.




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