Features: `Voltage ratings to 1000V`Average power dissipation to 6 W`Series resistance as low as 0.4 `Carrier lifetime greater than 1.0 s`Non cavity design`Thermally matched configuration`Low capacitance at 0 V bias`Low conducta...
UM6000: Features: `Voltage ratings to 1000V`Average power dissipation to 6 W`Series resistance as low as 0.4 `Carrier lifetime greater than 1.0 s`Non cavity design...
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Package |
Condition |
UM6000/UM6600 |
UM6200 |
PD |
PD | ||
A & C |
25 °C Pin Temperature |
6 W 25 °C/W |
4 W 37.5 °C/W |
B & E |
½ in. total length to 25 °C Contact Free Air |
2.5 W 60 °C/W 0.5 W |
2.0 W 75 °C/W 0.5 W |
SM |
25 °C End Cap Temperature |
4.5 W 27.5°C/W |
3.0 W 42.5 °C/W |
All |
1 us pulse (Single) |
UM6000 25 kW UM6600 13 kW |
10 kW |
These series of PIN diodes are designed for applications requiring small package size and moderate average power handling capability. The low capacitance of the UM6000 and UM6600 allows them to be used as series switching elements to 1 GHz. The low resistance of the UM6200 is useful in applications where forward bias current must be minimized.
Because of its thick I-region width and long lifetime the UM6000 and UM6600 have been used in distortion sensitive and high peak power applications, including receiver protectors, TACN, and IFF equipment. Their low capacitance allows them to be useful as attenuator diodes at frequencies greater than 1 GHz. The UM6200 has been used successfully in switches in which low insertion loss at low bias current is required. The "A" style package for this series is the smallest Microsemi PIN diode package. It has been used successfully in many microwave applications using coaxial, microstrip, and stripline techniques at frequencies beyond XBand.
The "B" and "E" style leaded packages offer the highest available power dissipation for a package this small. They have been used extensively as series switch elements in microstrip circuits. The "C" style package duplicates the physical outline available in conventional ceramic-metal packages but incorporates the many reliability advantages of the Microsemi construction.