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UH1D

Features: • Low profile package• Ideal for automated placement• Oxide planar chip junction• Ultrafast recovery times for high frequency• Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C• Solder dip 260 °C, 40 s• Component in accordance to RoHS 2...

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SeekIC No. : 004536931 Detail

UH1D: Features: • Low profile package• Ideal for automated placement• Oxide planar chip junction• Ultrafast recovery times for high frequency• Meets MSL level 1, per J-STD-02...

UH1D Data Sheet

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Part Number:
UH1D
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/1/6

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Product Details

Description



Features:

• Low profile package
• Ideal for automated placement
• Oxide planar chip junction
• Ultrafast recovery times for high frequency
• Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C
• Solder dip 260 °C, 40 s
• Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC




Application

For use in secondary rectification and freewheeling for ultrafast switching speeds ac-to-ac and dc-to-dc converters in high temperature conditions for both consumer and automotive applications.






Specifications

PARAMETER SYMBOL UH1B UH1C UH1D UNIT
Device marking code HB HC HD
Maximum repetitive peak reverse voltage VRRM 100 150 200 V
Maximum average forward rectified current
(Fig. 1)		 IF(AV) 1.0 A
Peak forward surge current 8.3 ms single half sine-wave
superimposed on rated load		 IFSM 30 A
Operating junction and storage temperature range TJ, TSTG - 55 to + 175





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