Features: • Glass passivated chip junction• Ultrafast recovery time• Low switching losses, high efficiency• High forward surge capability• Meets MSL level 1, per J-STD-020, LF maximum peak of 245 (for TO-263AB package)• Solder dip 260 , 40 s (for TO-220AC and IT...
UG8CT: Features: • Glass passivated chip junction• Ultrafast recovery time• Low switching losses, high efficiency• High forward surge capability• Meets MSL level 1, per J-STD-...
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PARAMETER |
SYMBOL |
UG8AT |
UG8BT |
UG8CT |
UG8DT |
UNIT |
Maximum repetitive peak reverse voltage |
VRRM |
50 |
100 |
150 |
200 |
V |
Maximum RMS voltage |
VRMS |
35 |
70 |
105 |
140 |
V |
Maximum DC blocking voltage |
VDC |
50 |
100 |
150 |
200 |
V |
Maximum average forward rectified current at TC = 100 |
I F(AV) |
8.0 |
A | |||
Peak forward surge current 8.3 ms single half sine-wave superimposed on rated load |
IFSM |
150 |
A | |||
Operating junction and storage temperature range |
TJ,TSTG |
- 55 to + 150 |
||||
Isolation voltage (ITO-220AC only) from terminals to heatsink t = 1 min |
VAC |
1500 |
V |