Features: · Input from Digital Controller Sets Operating Frequency and Duty Cycle· Up to 2-MHz Switching Frequency· Dual Current Limit Protection with Independently Adjustable Thresholds· Fast Current Sense Circuit with Adjustable Blanking Interval Prevents Catastrophic Current Levels· Digital Out...
UCD7230: Features: · Input from Digital Controller Sets Operating Frequency and Duty Cycle· Up to 2-MHz Switching Frequency· Dual Current Limit Protection with Independently Adjustable Thresholds· Fast Curre...
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PARAMETER | CONDITION | VALUE | UNIT | |
VDD | Supply voltage | 16 | V | |
BST | SW + 16 | |||
IDD | Supply current | Quiescent | 20 | mA |
Switching, TA = 25°C, VDD = 12 V |
200 | |||
VO | Output gate drive voltage | OUT1, BST | -1 V to 36 | V V |
OUT2 | -1 V to VDD+0.3 | |||
Output gate drive voltage | Output gate drive current | OUT1 | 4.0 | A |
IOUT(source) | OUT1 | -2.0 | ||
IOUT(sink) | OUT2 | 4.0 | ||
IOUT(source) | OUT2 | -4.0 | ||
Analog inputs | SW | -1 to 20 | V | |
CS+ | -0.3 to 20 | |||
CSBIAS | -0.3 to 16 | |||
POS, NEG | -0.3 to 5.6 | |||
ILIM, DLY, I0 | -0.3 to 3.6 | |||
Analog output | A0 | -0.3 to 3.6 | ||
Digital I/O's | IN, SRE, CLF | -0.3 to 3.6 | ||
Power dissipation | TA = 25°C (PWP-20 package) | 2.67 | W | |
TA = 25°C (QFN-20 package) | ||||
TJ | Junction operating temperature | -55 to 150 | °C | |
Tstg | Storage temperature | -55 to 150 | ||
HBM | ESD rating | Human body model | 2000 | V |
CDM | Charged device model | 500 | ||
Lead temperature (soldering, 10 sec) | 300 | °C |
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other condition beyond those indicated is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. All voltages are with respect to GND. Currents are positive into, negative out of the specified terminal. Consult company packaging information for thermal limitations and considerations of packages.