UCC37321

`Industry-Standard Pin-Out With Addition of Enable Funtion
`High-Peak Current Drive Capability of ±9 A at the Miller Plateau Region Using TrueDrive
`Efficient Constant Current Sourcing Using a Unique BiPolar & CMOS Output Stage
`TTL/CMOS Compatible Inputs Independent of Supply Voltage
`20-ns Typical Rise and Fall Times with 10-nF Load
`Typical Propagation Delay Times of 25 ns With Input Falling and 35 ns with Input Rising
`4-V to 15-V Supply Voltage
`Available in Thermally Enhanced MSOP PowerPADTM Package With 4.7/W jc
`Rated From 40 to 105
`Pb-Free Finish (NiPdAu) on SOIC-8 and PDIP-8 Packages

The UCC37321/2 family of high-speed drivers deliver 9 A of peak drive current in an industry standard pinout. These drivers can drive the
largest of MOSFETs for systems requiring extreme Miller current due to high dV/dt transitions. This eliminates additional external circuits and can replace multiple components to reduce space, design complexity and assembly cost. Two standard logic options are offered, inverting (UCC37321) and noninverting (UCC37322).

Using a design that inherently minimizes shoot-through current, the outputs of these can provide high gate drive current where it is most needed at the Miller plateau region during the MOSFET switching transition. A unique hybrid output stage paralleling bipolar and MOSFET transistors (TrueDrive) allows efficient current delivery at low supply voltages. With this drive architecture, UCC37321/2/3 can be used in industry standard 6-A, 9-A and many 12-A driver applications. Latch up and ESD protection circuitries are also included. Finally, the UCC37321/2 provides an enable (ENBL) function to have better control of the operation of the driver applications. ENBL is implemented on pin 3 which was previously left unused in the industry standard pin−out. It is internally pulled up to Vdd for active high logic and can be left open for standard operation.

In addition to SOIC-8 (D) and PDIP-8 (P) package offerings, the UCC37321/2 also comes in the thermally enhanced but tiny 8-pin MSOP PowerPAD (DGN) package. The PowerPAD^TM package drastically lowers the thermal resistance to extend the temperature operation range and improve the long-term reliability.