Features: · Maximizes Efficiency by Minimizing Body-Diode Conduction and Reverse Recovery Losses· Transparent Synchronous Buck Gate Drive Operation From the Single Ended PWM Input Signal· 12-V or 5-V Input Operation· 3.3-V Input Operation With Availability of 12-V Bus Bias· High-Side and Low-Side ...
UCC27223: Features: · Maximizes Efficiency by Minimizing Body-Diode Conduction and Reverse Recovery Losses· Transparent Synchronous Buck Gate Drive Operation From the Single Ended PWM Input Signal· 12-V or 5-...
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· Maximizes Efficiency by Minimizing Body-Diode Conduction and Reverse Recovery Losses
· Transparent Synchronous Buck Gate Drive Operation From the Single Ended PWM Input Signal
· 12-V or 5-V Input Operation
· 3.3-V Input Operation With Availability of 12-V Bus Bias
· High-Side and Low-Side ±3-A Dual Drivers
· On-Board 6.5-V Gate Drive Regulator
· ±3-A TrueDrive™Gate Drives for High Current Delivery at MOSFET Miller Thresholds
· Automatically Adjusts for Changing Operating Conditions
· Thermally Enhanced 14-Pin PowerPAD
HTSSOP Package Minimizes Board Area and Junction Temperature Rise
The UCC27223 is a high-speed synchronous uck drivers for today's high-efficiency,lower-output voltage designs. Using Predictive ate Drive (PGD) control technology, these rivers reduce diode conduction and reverse ecovery losses in the synchronous rectifier OSFET(s).
The UCC27223 includes an enable pin that ontrols the operation of both outputs. A logic atch is also included to keep both outputs low until he first PWM input pulse comes in. The RDS(on) f the SR pull-down sourcing device is also inimized for higher frequency operations.
This closed loop feedback system detects ody-diode conduction, and adjusts deadtime elays to minimize the conduction time interval. his virtually eliminates body-diode conduction hile adjusting for temperature, load- dependent elays, and for different MOSFETs. Precise gate iming at the nanosecond level reduces the everse recovery time of the synchronous rectifier OSFET body-diode, reducing reverse recovery osses seen in the main (high-side) MOSFET. The ower junction temperature in the low-side OSFET increases product reliability. Since the ower dissipation is minimized, a higher switching requency can also be used, allowing for smaller omponent sizes.
The UCC27223 is offered in the thermally enhanced 14-pin PowerPAD package with 2°C/W jc.