UCC27223

Features: · Maximizes Efficiency by Minimizing Body-Diode Conduction and Reverse Recovery Losses· Transparent Synchronous Buck Gate Drive Operation From the Single Ended PWM Input Signal· 12-V or 5-V Input Operation· 3.3-V Input Operation With Availability of 12-V Bus Bias· High-Side and Low-Side ...

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UCC27223 Picture
SeekIC No. : 004535816 Detail

UCC27223: Features: · Maximizes Efficiency by Minimizing Body-Diode Conduction and Reverse Recovery Losses· Transparent Synchronous Buck Gate Drive Operation From the Single Ended PWM Input Signal· 12-V or 5-...

floor Price/Ceiling Price

Part Number:
UCC27223
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/1/7

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Product Details

Description



Features:

· Maximizes Efficiency by Minimizing Body-Diode Conduction and Reverse Recovery Losses
· Transparent Synchronous Buck Gate Drive Operation From the Single Ended PWM Input Signal
· 12-V or 5-V Input Operation
· 3.3-V Input Operation With Availability of 12-V Bus Bias
· High-Side and Low-Side ±3-A Dual Drivers
· On-Board 6.5-V Gate Drive Regulator
· ±3-A TrueDrive™Gate Drives for High Current Delivery at MOSFET Miller Thresholds
· Automatically Adjusts for Changing Operating Conditions
· Thermally Enhanced 14-Pin PowerPAD
    HTSSOP Package Minimizes Board Area and Junction Temperature Rise




Application

· Multiphase Converters in Combination With the TPS40090
· Non-Isolated 3.3-V, 5-V and 12-V Input dc-to-dc Converters for Processor Power,General Computer, Telecom and Datacom Applications



Pinout

  Connection Diagram


Specifications

Supply voltage range, VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  . . −0.3 to 20 V
Input voltage, VHI . . . . . . . . . . . . . . . . . . . . . . . . .  . . . . . . . . . . . . . . . . . . . 30 V
SW, SWS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . .  . .  . 20 V
Supply current, IDD, including gate drive current . . . . . . . . . . . . . . . . . . ..100 mA
Sink current (peak) pulsed, G1/G2 . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . 4.0 A
Source current (peak) pulsed, G1/G2 . . . . . . . . . . . . . . . . . . . . .  . . . . . . . −4.0 A
Analog inputs, IN, ENBL . . . . . . . . . . . . .−3.0 V to VDD + 0.3 V, not to exceed 15
Power Dissipation at TA = 25°C (PWP package) . . . . . . . . . .  . . . . . . . . . . . 3 W
Operating junction temperature range, TJ . . . . . . . . . . . . . .  . −55°C to 115°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . .  . . −65°C to 150°C
Lead temperature soldering 1.6 mm (1/16 inch)
from case for 10 seconds . . . . . . ..............................................................300°C

† Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and unctional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not mplied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
‡ All voltages are with respect to AGND and PGND. Currents are positive into, negative out of the specified terminal.



Description

The UCC27223 is a high-speed synchronous uck drivers for today's high-efficiency,lower-output voltage designs. Using Predictive ate Drive (PGD) control technology, these rivers reduce diode conduction and reverse ecovery losses in the synchronous rectifier OSFET(s).

The UCC27223 includes an enable pin that ontrols the operation of both outputs. A logic atch is also included to keep both outputs low until he first PWM input pulse comes in. The RDS(on) f the SR pull-down sourcing device is also inimized for higher frequency operations.

This closed loop feedback system detects ody-diode conduction, and adjusts deadtime elays to minimize the conduction time interval. his virtually eliminates body-diode conduction hile adjusting for temperature, load- dependent elays, and for different MOSFETs. Precise gate iming at the nanosecond level reduces the everse recovery time of the synchronous rectifier OSFET body-diode, reducing reverse recovery osses seen in the main (high-side) MOSFET. The ower junction temperature in the low-side OSFET increases product reliability. Since the ower dissipation is minimized, a higher switching requency can also be used, allowing for smaller omponent sizes.

The UCC27223 is offered in the thermally enhanced 14-pin PowerPAD package with 2°C/W jc.




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