TTIA0110G

Features: ` High data rate` 1.3 kW transimpedance` Complementary 50 W outputs` Equivalent input noise current 1 mArms` Group delay ±20 ps` Broad dynamic range` Single 5.0 V or 5.2 V ECL power supply` Power dissipation 0.85 W` 10 GHz bandwidthApplication·SONET/SDH OC-192/STM-64 receivers·SONET/SDH ...

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SeekIC No. : 004533706 Detail

TTIA0110G: Features: ` High data rate` 1.3 kW transimpedance` Complementary 50 W outputs` Equivalent input noise current 1 mArms` Group delay ±20 ps` Broad dynamic range` Single 5.0 V or 5.2 V ECL power supply...

floor Price/Ceiling Price

Part Number:
TTIA0110G
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/21

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Product Details

Description



Features:

` High data rate
` 1.3 kW transimpedance
` Complementary 50 W outputs
` Equivalent input noise current 1 mArms
` Group delay ±20 ps
` Broad dynamic range
` Single 5.0 V or 5.2 V ECL power supply
` Power dissipation 0.85 W
` 10 GHz bandwidth



Application

·SONET/SDH OC-192/STM-64 receivers
·SONET/SDH OC-192/STM-64 test equipment
·Digital video transmission



Description

The Lucent Technologies Microelectronics Group TTIA0110G is a hybrid integrated circuit that combines a transimpedance amplifier die (TTIA0110GA) with necessary filtering to achieve a broad dynamic range amplifier. A typical application is a low-noise, high-speed lightwave receiver when combined with an APD or PIN photodetector.

The targeted transmission system is OC-192/STM-64. The amplifier consists of a differential transimpedance stage followed by an output buffer which provides complementary 50 W outputs. A wide dynamic range of linear operation is achieved by combining a low-noise input stage with an output buffer capable of providing a single-ended output swing of 1 Vp-p. Large output swings provide linear operation up to 400 mA average input current. Amplifier operation is from a single 5.0 V power supply.

The amplifier is available as a die or in a hybrid integrated circuit, which includes the bypassing and overload control circuitry.




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