Features: ·Package in 8mm tape on 7 diameter reel ·Compatible with automatic placement equipment ·Compatible with infrared and vapor phase reflow solder process·Mono-color type ·RoHS complianceApplication·Automotive: Backlighting in dashboards and switch ·Telecommunication: indicator and backlight...
TSP2-XF2012A3: Features: ·Package in 8mm tape on 7 diameter reel ·Compatible with automatic placement equipment ·Compatible with infrared and vapor phase reflow solder process·Mono-color type ·RoHS complianceAppli...
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Parameter |
Symbol |
Value |
Unit |
Reverse Voltage |
VR |
5 |
V |
Forward Current |
IF |
25 |
mA |
Peak Forward Current (Duty 1/10@1KHz) |
IF(Peak) |
160 |
mA |
Power Dissipation |
Pd |
60 |
mW |
Electrostatic Discharge |
ESD |
2000 |
V |
Soldering Temperature |
Tsol |
260 (for 5 seconds) |
|
Operating Temperature |
Topr |
-40~+85 |
|
Storage Temperature |
Tstg |
-40~+90 |
This TSP2-XF2012A3 SMD Taping is much smaller than leaded components, thus enable smaller board higher packing density, reduced e space and finally smaller equipment to be obtained. Light weight makes them ideal for miniature applications