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TSP1-XF1608H8A4

Features: • Package in 8mm tape on 7 diameter reel• Compatible with automatic placement equipment• Compatible with infrared and vapor phase reflow solder process• Mono-color type• RoHS complianceSpecifications Parameter Symbol Value Unit Reverse ...

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SeekIC No. : 004530585 Detail

TSP1-XF1608H8A4: Features: • Package in 8mm tape on 7 diameter reel• Compatible with automatic placement equipment• Compatible with infrared and vapor phase reflow solder process• Mono-color...

TSP1-XF1608H8A4 Data Sheet

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Part Number:
TSP1-XF1608H8A4
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/1/11

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Product Details

Description



Features:

• Package in 8mm tape on 7" diameter reel
• Compatible with automatic placement equipment
• Compatible with infrared and vapor phase reflow solder process
• Mono-color type
• RoHS compliance




Specifications

Parameter

Symbol

Value

Unit

Reverse Voltage

VR

5

V

Forward Current

IF

25

mA

Peak Forward Current
(Duty 1/10 @1KHz)

IFP

100

mA

Power Dissipation

Pd

60

mW

Electrostatic Discharge

ESD

2000

V

Soldering Temperature

Tso

260 (for 5 seconds)

Operating Temperature

Topr

-40 ~ +85

Storage Temperature

Tstg

-40 ~ +90






Description

• The TSP1-XF1608H8A4 SMD series enables smaller board size, higher packing density, reduced storage space, and small equipment
• Light weight makes them ideal for miniature applications
• Applications include automotive, telecommunications and backlighting






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