Position: Home  > All Categories> Integrated Circuits (ICs) > TSP1-BF1608H6-L1M2Y

TSP1-BF1608H6-L1M2Y

Features: • Package in 8mm tape on 7 diameter reel• Compatible with automatic placement equipment• Compatible with infrared and vapor phase reflow solder process• Mono-color type• RoHS CompliantApplication• Backlighting in dashboard and switch• Telecommun...

product image

TSP1-BF1608H6-L1M2Y Picture
See larger image
SeekIC No. : 004530577 Detail

TSP1-BF1608H6-L1M2Y: Features: • Package in 8mm tape on 7 diameter reel• Compatible with automatic placement equipment• Compatible with infrared and vapor phase reflow solder process• Mono-color...

TSP1-BF1608H6-L1M2Y Data Sheet

floor Price/Ceiling Price

Get Latest Price
Part Number:
TSP1-BF1608H6-L1M2Y
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

SeekIC Buyer Protection PLUS - newly updated for 2013!

  • Escrow Protection.
  • Guaranteed refunds.
  • Secure payments.
  • Learn more >>

Month Sales

268 Transactions

Rating

evaluate  (4.8 stars)

Upload time: 2024/12/25

add to my favourite

Payment Methods

All payment methods are secure and covered by SeekIC Buyer Protection PLUS.

Notice: When you place an order, your payment is made to SeekIC and not to your seller. SeekIC only pays the seller after confirming you have received your order. We will also never share your payment details with your seller.
Product Details

Description



Features:

• Package in 8mm tape on 7" diameter reel
• Compatible with automatic placement equipment
• Compatible with infrared and vapor phase reflow solder process
• Mono-color type
• RoHS Compliant


Application

• Backlighting in dashboard and switch
• Telecommunication: indicator and backlighting in telephone and fax
• Flat backlight for LCD, switch and symbol
• General use


Specifications

Parameter
Symbol
Rating
Unit
Reverse Voltage
VR
5
V
Forward Current
IF
25
mA
Operating Temperature
Topr
-40~ +85
Storage Temperature
Tstg
-40 ~ +90
Soldering Temperature
Tsol
Reflow soldering: 260 (for 10 seconds)
Hand soldering: 350 (for 3 seconds)
Electrostatic Discharge (HBM)
ESD
150
V
Power Dissipation
Pd
110
mW
Peak Forward Current
(Duty 1/10 @1KHz)
IFP
100
mA



Description

• The TSP1-BF1608H6-L1M2Y SMD Taping is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained.
• Besides, lightweight makes them ideal for miniature applications. etc.




Customers Who Bought This Item Also Bought

Margin,quality,low-cost products with low minimum orders. Secure your online payments with SeekIC Buyer Protection.
You may also be interested in :
Connectors, Interconnects
ASP-134488-01
WM4078-ND
Inductors, Coils, Chokes
DR127-330-R
SD53-100-R
LED Products
LM24P20
KCG057QV1DB-G770
Capacitors
GRM188R71H103KA01D
GRM21BR71H104KA01L
Semiconductor Modules
2DI300A-050-03
7MBR25SA-120-50
Memory Cards, Modules
WT32
VTL5C7
View more