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TSM8405P

Features: ·Low profile package: less than 0.8mm height when mounted on PCB·Occupies only 2.25mm2 of PCB area·Less than 25% of the area of a SSOT-6·Excellent thermal and electrical capabilities·Lead free solder bumps availableSpecifications Parameter Symbol Limi t Unit Drain-Source Volta...

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SeekIC No. : 004529706 Detail

TSM8405P: Features: ·Low profile package: less than 0.8mm height when mounted on PCB·Occupies only 2.25mm2 of PCB area·Less than 25% of the area of a SSOT-6·Excellent thermal and electrical capabilities·Lead ...

TSM8405P Data Sheet

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Part Number:
TSM8405P
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/1/11

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Product Details

Description



Features:

·Low profile package: less than 0.8mm height when mounted on PCB
·Occupies only 2.25mm2 of PCB area
·Less than 25% of the area of a SSOT-6
·Excellent thermal and electrical capabilities
·Lead free solder bumps available


Specifications

Parameter Symbol Limi t Unit
Drain-Source Voltage VDS -12V V
Gate-Source Voltage VGS ±8 V
Continuous Drain Current ID -4.9 mA
Pulsed Drain Current IDM -10 mA
Maximum Power Dissipation (Steady State) PD

1.5

 mW
Junction and Storage Temperature Range TJ,Tstg -55 to +150
Junction-to Ambient Thermal Resistance(PCB mounted)2 TJ +150 /W



Description

TSM8405P is new low cost, state of the art MicroSURFTM lateral MOSFET process technology in chip scale bondwireless packaging minimizes PCB space and Rds(on) plus provides an ultra low Qg x Rds(on) figure of merit.




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