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TSF-6522

Features: • High tack values and long tack life• Leaves bright/shiny solder joints after reflow• ANSI/J-STD-004 flux designator ROL0• Can reflow in air or nitrogen environmentsApplication• Works on flip chip, chip scale package and flip chip bumping sites assemblies a...

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SeekIC No. : 004529423 Detail

TSF-6522: Features: • High tack values and long tack life• Leaves bright/shiny solder joints after reflow• ANSI/J-STD-004 flux designator ROL0• Can reflow in air or nitrogen environmen...

TSF-6522 Data Sheet

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Part Number:
TSF-6522
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/1/11

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Product Details

Description



Features:

• High tack values and long tack life
• Leaves bright/shiny solder joints after reflow
• ANSI/J-STD-004 flux designator ROL0
• Can reflow in air or nitrogen environments



Application

• Works on flip chip, chip scale package and flip chip bumping sites assemblies as a soldering flux.
• Tacky solder flux formulations are designed for pin transfer, dot dispensing and/or syringe applications.
• Tacky solder flux formulations can be used as a tack and flux vehicle for soldering components to a solid 
   solder deposit (SSD), or precision pad technology (PPT) board surfaces.
• Great for rework applications on all PCB packages.
• Can be used in BGA/PGA sphere/pin attachment vehicle or for repair and reballing/repinning.


Description

Kester formula TSF-6522 is a no-clean tacky soldering flux formula designed to be used with a rotating disc, a doctor blade, or a drum fluxer. The TSF-6522 can also be used in dot dispensing for BGA/PGA sites or in a rework application for surface mount packages. TSF-6522 maintains its activity and dispensing characteristics for up to 8 hours and can be used in a wide range of temperature and humidity conditions. Kester maintains the highest standards by manufacturing the TSF-6522 under a vacuum environment.




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